TerraGreen® 400G (RF/MW)

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, extremely low loss design solution.

Download Data Sheet Contact Us

Thermal Performance

Tg: 210°C
Td: 400°C

Electrical Performance

Dk: 3.07
Df: 0.0018

Industry Approvals

UL - File Number E41625

TerraGreen® 400G (RF/MW) is our Halogen Free material solution for next generation 5G infrastructure and mm wave applications. Our novel resin system has been engineered for high data rates with excellent cost for loss performance.

TerraGreen® 400G (RF/MW) is lead free compatible and can be processed utilizing standard PCB equipment and processing steps.

TerraGreen®  400G (RF/MW) meets UL 94 V-0 and is halogen free.

Attributes

RadioFrequencyMicrowave 1 HighThermalReliability Asset 12

Markets

AutomotiveTransportation RadioFrequencyMicrowave AerospaceDefense

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
  • Processing Advantages
    • FR-4 process compatible
    • Excellent fill and flow for heavy copper

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)
  • Copper Foil Type
    • HLVP3 (VLP1) ≤1.1 micron Rz JIS, 1/2 and 1 oz
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
  • Glass Fabric Availability
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 — —
Glass Transition Temperature (Tg) by DMA 210 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 400 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) T288 60+ Minutes 2.4.24.1
Z-Axis CTE 50 to 260°C, (Total Expansion) 2.8 * % 2.4.24C
X/Y-Axis CTE Pre-Tg 12 * ppm/°C 2.4.24C
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity @ 10 GHz 3.07 — 2.5.5.5
Df, Loss Tangent @ 10 GHz 0.0018 — Bereskin Stripline
Peel Strength Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
0.65 (3.9) 		N/mm (lb/inch) 2.4.8C
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release

Download Dk/Df Tables PDF

Core Data

Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
0.0025 0.064 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018
0.0050 0.127 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018
0.0100 0.254 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018
0.0200 0.508 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018		 3.07
0.0018

NOTE

***ALL DATA IS PRELIMINARY AND SUBJECT TO CHANGE AS ADDITIONAL DATA BECOMES AVAILABLE***

Revisions:
A - Original 6/2022
All TerraGreen 400G glass is Spread in both directions

Resource Title & Summary Date Updated
TerraGreen 400G Prepreg 2022 RoHS 11/01/2022
TerraGreen 400G Laminate 2022 RoHS 11/01/2022
TerraGreen® 400G Laminate Supplemental 12/15/2021

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