Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => 1 ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 200 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.06 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 400C ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0009 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => <0.1 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 1.9 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => (3.2) ) [tg] => Array ( [value] => 200°C ) [td] => Array ( [value] => 380°C ) )

Tachyon<sup>®</sup> 200JV

Tachyon^® 200JV

Halogen-free, Ultra Low Loss Material

Tachyon® 200JV laminate materials are latest generation of advanced ultra-high speed, halogen free, ultra-low loss materials.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 222°C Td: 400°C	Dk: 3.06 Df: 0.0009	UL - File Number E41625

Thermal Performance

Tg: 222°C
Td: 400°C

Electrical Performance

Dk: 3.06
Df: 0.0009

Industry Approvals

UL - File Number E41625

Tachyon® 200JV is our latest Halogen Free material solution for next generation AI Data Center Server, 5G infrastructure, high end computing as well as wired & wireless communications. Our most advanced resin system has been developed with ultra smooth HVLP4/5 copper foil and the most advanced glass offerings in the industry to deliver a solution capable of meeting the most demanding high data rate requirements with excellent cost for loss performance.

The Tachyon® 200JV resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

Tachyon® 200JV is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. Tachyon® 200JV meets UL94 V-0.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Low moisture absorption
- Halogen free
- 6x 260°C reflow capable
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible
- Excellent Fill and Flow
- Multiple lamination cycles
- HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

Standard Material Offering: Laminate
- 2 to 10 mil (0.05 to 0.25 mm)

Copper Foil Type
- HVLP3 (VLP1) ≤1.1 micron Rz JIS

Copper Weight
- ⅓, ½, 1 oz (12, 18 and 35 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- Low Dk glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Glass Transition Temperature (Tg) by DMA		222	°C	2.4.24.4
Glass Transition Temperature (Tg) by TMA		185	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		400C	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T288 B. T300	N/A >120	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	31 190 1.9	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE		6/6	ppm/°C	2.4.24C
Thermal Conductivity		0.54	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 10 GHz B. @ 20 GHz	3.06	—	2.5.5.5
Df, Loss Tangent	A. @ 10 GHz B. @ 20 GHz	0.0009	—	2.5.5.5
Volume Resistivity	C-96/35/90	—	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	—	MΩ	2.5.17.1
Dielectric Breakdown		—	kV	2.5.6B
Arc Resistance		—	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		—	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		—	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile and very low profile copper foil B. Low profile and very low profile copper foil ... After thermal stress	(3.2)	N/mm (lb/inch)	2.4.8C 2.4.8.2A
Flexural Strength	A. Length direction B. Cross direction	—	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	—	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	—	GPa(kpsi)	ASTM D790-15e2
Flexural Modulus	A. Lengthwise B. Crosswise	—	GPa (kpsi)	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	—	—	ASTM D3039
Moisture Absorption		<0.1	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		—	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release
B: Corrected units of Youngs Modulus from MPa to GPa - 1/24

Constructions ▼

Download Dk/Df Tables PDF

Documentation ▼

Resource Title & Summary	Date Updated

General Form Proposal

First Name*
Last Name*
Email*
Region*
Inquiry type*
Company Name*
Job Title*
Phone*
Zip Code*
ZIP / Postal Code
In your own words, please describe how we can help you.*
<a href="https://www.isola-group.com/privacy-policy/" target="_blank">Privacy Notice</a>*
- I have read and accept these terms
Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.
CAPTCHA

jQuery(document).ready(function() { jQuery('.product-list-wrap .flex-wrap .w-full:nth-child(1) .pb-2').each(function() { var html = jQuery(this).html().split(" "); html = html.slice(0,4).join(" ") + "
" + html.slice(4).join(" "); jQuery(this).html(html); }); });

Top

Property		Tachyon^® 200JV
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.06
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	400C
Df, Loss Tangent	Resin Content	0.0009
Moisture Absorption	Resin Content	<0.1
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.9
Peel Strength	Standard profile copper >>> After thermal stress	(3.2)

Tachyon® 200JV

Halogen-free, Ultra Low Loss Material

Tachyon® 200JV laminate materials are latest generation of advanced ultra-high speed, halogen free, ultra-low loss materials.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Add a Product to Compare to Tachyon® 200JV

General Form Proposal

Tachyon^® 200JV

Add a Product to Compare to Tachyon^® 200JV