FR406N

Lo-Flo® Specialty Prepreg

Isola offers a FR406N family of low-flow prepregs consisting of proprietary resin systems specifically formulated for optimal performance in bonding applications requiring minimal resin flow and consistency in lamination.

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Thermal Performance

Tg: 170°C
Td: 300°C

Electrical Performance

Dk: 4.3
Df: 0.025

Industry Approvals

IPC-4101 /21 /24 /26
UL - File Number E41625

FR406 Lo-Flo® products bring the fabricator specific thermal characteristics appropriate for use in multilayer rigid-flex applications.

Attributes

Asset 7 Asset 11

Markets

AerospaceDefense

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Processing Advantages
    • Machinable by steel rule die or punch
    • Consistent dielectric spacing
    • Complete encapsulation of non-planar surfaces
    • Cure and form bond at low temperatures
    • Allows for lamination at non-uniform pressures
  • Low-flow Prepreg
    • Adhesion to wide range of materials
    • Flex films – (Mylar®, Kapton®, etc.)
    • Treated or untreated copper
    • Plated metals (tin, solder, nickel, etc.)
    • Conventional laminate surfaces

Production & Manufacturing

Currently manufactured in Asia, North America

Product Availability

  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Pressed Thickness
A. 106
B. 1080
C. 1080
0.043 (1.7)
0.069 (2.7)
0.083 (3.2)
 mm (mil) —
Resin Content
A. 106
B. 1080
C. 1080
65 ±1.5
60 ±1.5
65 ±1.5
 % —
Resin Flow Testing
A. 106
B. 1080
 R&R —
2.3.17
Modified Circle Flow
A. 106
B. 1080
C. 1080
D. 1080
0.050-0.120
0.05-0.12 (60% RC)
0.05-0.12 (65% RC)
0.08-0.18 (65% RC)
 — —
Glass Transition Temperature (Tg) by DSC 170 °C 2.4.25C
Cure Temperature Recommended for Full Cure 185 °C —
Min. for Functional Bonding 165 °C —
Z-Axis CTE Pre-Tg 75 ppm/°C 2.4.24C
X/Y-Axis CTE Pre-Tg 17/20 ppm/°C 2.4.24C
Thermal Conductivity .30 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Electric Strength (Laminate & laminated prepreg) 70 (1750) kV/mm (V/mil) 2.5.6.2A
Peel Strength Standard profile copper >>> After thermal stress 1.75 (10.0) N/mm (lb/inch) 2.4.8C
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Revisions:
A: Initial release - 4/17
B: Added SI units to Electrical Strength and Peel Strength - 3/22
C: Corrected z-Axis CTE value to Pre-Tg - 05/23
D: Added 1080 60% RC and corrected MCF value for 1080 65%RC- 10/23
E: Removed reference to No-Flo prepreg 08/24