FR408HR

Lead Free, Mid Loss Laminate and Prepreg

FR408HR is a high-performance FR-4 resin system with a 230°C (DMA) Tg for multilayer PCB applications where maximum thermal performance and reliability are required.

Thermal Performance

Tg: 190°C
Td: 360°C

Electrical Performance

Dk: 3.68
Df: 0.0092

Industry Approvals

IPC-4101 /98 /99 /101 /126
UL - File Number E41625

FR408HR laminate and prepreg products are manufactured with Isola’s patented high performance multifunctional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 30% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

The FR408HR system is also laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo-imagable solder mask imaging.

Attributes

Markets

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible
    • Via filling capability
    • Multiple lamination cycles

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

  • Standard Material Offering: Laminate
    • Available in full size sheet or panel form
  • Copper Foil Type
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½ to 2 oz (18 to 70 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 190 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60
>30
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
230
2.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
3.72
3.69
3.68
3.64
3.65
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 1 GHz
C. @ 2 GHz
D. @ 5 GHz
E. @ 10 GHz
0.0072
0.0091
0.0092
0.0098
0.0095
2.5.5.3
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.4 x 107
9.4 x 107
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.6 x 106
2.1 x 108
2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 137 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
72.5
58.0
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
54.5
38.7
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3695
3315
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.137
0.133
ASTM D3039
Moisture Absorption 0.061 % 2.6.2.1A
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Removed Low Dk Glass Option - 10/18
D: Change MOT to RTI - 5/19
E: Revised CTI to 2 - 1/21

Core Data

ConstructionResin Content %Standard/ AlternateThickness (inch) Dielectric Constant (DK)/ Dissipation Factor (DF)
Thickness (mm)100 MHz500 MHz1 GHz2 GHz5 GHz10 Ghz
1x10672.0%Standard0.00200.05
0.0510
3.37
0.0075
3.36
0.0089
3.34
0.0096
3.32
0.0101
3.30
0.0107
3.30
0.0107
1x108057.0%Standard0.00250.06
0.0640
3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x106769.0%Alternate0.00250.06
0.0640
3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
1x108063.0%Standard0.00300.08
0.0760
3.54
0.0074
3.52
0.0082
3.50
0.0092
3.48
0.0096
3.47
0.0102
3.47
0.0101
1x108659.0%Alternate0.00300.08
0.0760
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x10667.0%Standard0.00350.09
0.0890
3.46
0.0074
3.45
0.0083
3.42
0.0094
3.40
0.0098
3.38
0.0104
3.37
0.0102
1x331351.0%Standard0.00350.09
0.0890
3.82
0.0068
3.79
0.0076
3.77
0.0084
3.77
0.0087
3.74
0.0092
3.74
0.0090
1x106/1x108059.0%Standard0.00400.10
0.1020
3.63
0.0072
3.61
0.0080
3.58
0.0090
3.57
0.0093
3.55
0.0098
3.54
0.0096
1x331355.0%Standard0.00400.10
0.1020
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x106/1x108061.0%Alternate0.00430.11
0.1090
3.57
0.0073
3.56
0.0081
3.54
0.0092
3.52
0.0095
3.51
0.0099
3.50
0.0098
1x211650.0%Standard0.00450.11
0.1140
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
1x106/1x108062.0%Standard0.00450.11
0.1140
3.55
0.0073
3.54
0.0082
3.52
0.0092
3.50
0.0095
3.48
0.0100
3.48
0.0098
2x106769.0%Alternate0.00500.13
0.1270
3.42
0.0075
3.40
0.0084
3.38
0.0095
3.36
0.0100
3.34
0.0105
3.33
0.0104
2x108057.0%Standard0.00500.13
0.1270
3.67
0.0071
3.64
0.0079
3.62
0.0089
3.61
0.0092
3.60
0.0097
3.59
0.0095
1x211654.0%Standard0.00500.13
0.1270
3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x108058.0%Standard0.00550.14
0.1400
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
2x108658.0%Alternate0.00600.15
0.1520
3.65
0.0072
3.63
0.0079
3.60
0.0091
3.59
0.0092
3.57
0.0098
3.57
0.0095
1x165250.0%Standard0.00600.15
0.1520
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x331350.0%Standard0.00700.18
0.1780
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x331355.0%Standard0.00800.20
0.2030
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
2x211654.0%Standard0.01000.25
0.2540
3.72
0.0070
3.71
0.0077
3.70
0.0086
3.69
0.0089
3.67
0.0095
3.67
0.0093
2x165242.0%Standard0.01000.25
0.2540
4.02
0.0065
4.01
0.0072
3.99
0.0080
3.98
0.0083
3.97
0.0088
3.96
0.0085
3x331355.0%Standard0.01200.31
0.3050
3.72
0.0071
3.70
0.0077
3.68
0.0087
3.66
0.0090
3.65
0.0095
3.65
0.0094
1x1080/2x165249.0%Standard0.01400.36
0.3560
3.86
0.0068
3.83
0.0074
3.81
0.0083
3.80
0.0086
3.78
0.0090
3.78
0.0089
3x165245.0%Standard0.01600.41
0.4060
3.95
0.0066
3.92
0.0072
3.91
0.0080
3.90
0.0083
3.89
0.0086
3.88
0.0085
3x165250.0%Standard0.01800.46
0.4570
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/2x165246.0%Alternate0.01900.48
0.4830
3.92
0.0066
3.90
0.0073
3.89
0.0081
3.87
0.0089
3.86
0.0087
3.85
0.0086
2x2116/2x165247.0%Alternate0.02000.51
0.5080
3.89
0.0067
3.88
0.0074
3.87
0.0083
3.85
0.0085
3.84
0.0089
3.83
0.0088
2x2116/2x165250.0%Alternate0.02100.53
0.5330
3.82
0.0068
3.81
0.0075
3.80
0.0083
3.79
0.0086
3.78
0.0091
3.76
0.0089
2x2116/3x165252.0%Alternate0.02800.71
0.7110
3.77
0.0073
3.76
0.0080
3.76
0.0088
3.75
0.0091
3.73
0.0093
3.73
0.0093

Prepreg Data

ConstructionResin Content %Standard/AlternateThickness (inch) Dielectric Constant (DK)/ Dissipation Factor (DF)
Thickness (mm)100 MHz500 MHz1 GHz2 GHz5 GHz10 GHz
10670.0%Standard0.00190.05
0.0480
3.40
0.0080
3.38
0.0090
3.36
0.0100
3.34
0.0100
3.32
0.0110
3.31
0.0110
10675.0%Standard0.00230.06
0.0580
3.30
0.0080
3.27
0.0090
3.26
0.0100
3.23
0.0110
3.22
0.0110
3.22
0.0110
106769.0%Standard0.00230.06
0.0580
3.42
0.0080
3.40
0.0080
3.38
0.0100
3.36
0.0100
3.34
0.0110
3.33
0.0100
106773.0%Standard0.00270.07
0.0690
3.33
0.0080
3.32
0.0090
3.30
0.0100
3.28
0.0100
3.26
0.0110
3.26
0.0110
108662.0%Standard0.00320.08
0.0810
3.55
0.0070
3.54
0.0080
3.52
0.0090
3.50
0.0100
3.48
0.0100
3.48
0.0100
108065.0%Standard0.00320.08
0.0810
3.50
0.0070
3.49
0.0080
3.46
0.0090
3.44
0.0100
3.42
0.0100
3.42
0.0100
108665.0%Standard0.00350.09
0.0890
3.50
0.0070
3.49
0.0080
3.46
0.0090
3.44
0.0100
3.42
0.0100
3.42
0.0100
108071.0%Standard0.00400.10
0.1020
3.37
0.0080
3.36
0.0090
3.34
0.0100
3.32
0.0100
3.30
0.0110
3.30
0.0110
231356.0%Standard0.00400.10
0.1020
3.70
0.0070
3.67
0.0080
3.65
0.0090
3.64
0.0090
3.63
0.0100
3.62
0.0100
331359.0%Standard0.00420.11
0.1070
3.63
0.0070
3.61
0.0080
3.58
0.0090
3.57
0.0090
3.55
0.0100
3.54
0.0100
211655.0%Standard0.00490.12
0.1240
3.72
0.0070
3.70
0.0080
3.68
0.0090
3.66
0.0090
3.65
0.0100
3.65
0.0090
211658.0%Alternate0.00540.14
0.1370
3.65
0.0070
3.63
0.0080
3.60
0.0090
3.59
0.0090
3.57
0.0100
3.56
0.0100

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C-Removed Low Dk glass option 10/18

D-1086 71% PP changed to Std/Spread-2/19
E-Corrected RC% on 3 mil 1086 from 58% to 59%
Standard- Available with the best availability.
Alternate-Available with longer lead time

Resources

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

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