IS580G

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IS580G

Halogen-free, Very Low Loss Material

IS580G is a halogen-free 205°C Tg resin system for multilayer PWB applications where maximum thermal performance and reliability are required.

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Thermal Performance	Electrical Performance	Industry Approvals
Tg: 205°C Td: 385°C	Dk: 3.80 Df: 0.006	IPC-4101 /140 UL - File Number E41625

Thermal Performance

Tg: 205°C
Td: 385°C

Electrical Performance

Dk: 3.80
Df: 0.006

Industry Approvals

IPC-4101 /140

UL - File Number E41625

IS580G laminate and prepreg products are manufactured with Isola’s high performance, low loss, multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. The unique resin system delivers a >25% improvement in Z-axis expansion while maintaining good flow and fill properties. These properties, coupled with superior moisture resistance at reflow, result in a halogen-free product with an industry-leading combination of thermal and electrical performance.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Low moisture absorption
- Halogen free
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible
- Excellent Fill and Flow
- Multiple lamination cycles
- HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

Standard Material Offering: Laminate
- 2 to 18 mil (0.05 to 0.46 mm)
- Available in full size sheet or panel form

Copper Foil Type
- RTF (Reverse Treat Foil)
- ½, 1 and 2 oz (18, 35 and 70 µm) available

Standard Material Offering: Prepreg
- Roll or panel form
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- E-glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DMA		205	°C	2.4.24.4
Glass Transition Temperature (Tg) by TMA		180	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		385	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T288 B. T300	60+	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	35 175 1.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE		13/14	ppm/°C	2.4.24C
Thermal Conductivity		0.5	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 5 GHz B. @ 10 GHz C. @ 20 GHz	3.8	—	Bereskin Stripline
Df, Loss Tangent	A. @ 5 GHz B. @ 10 GHz C. @ 20 GHz	0.006	—	Bereskin Stripline
Volume Resistivity	C-96/35/90	3x10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	3.5x10⁸	MΩ	2.5.17.1
Dielectric Breakdown		70	kV	2.5.6B
Arc Resistance		190	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		63(1600)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		2 (250-499)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low Profile copper foil and very low profile copper foil >17 um B. Low profile copper foil and very low profile copper foil 1. After thermal stress	0.73 (4.2) 0.75 (4.3)	N/mm (lb/inch)	2.4.8C 2.4.8.2A
Flexural Strength	A. Length direction B. Cross direction	537 (78) 393 (57)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	241 (35) 145 (21)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	25,000 (3,625) 23,000 (3,335)	MPa (ksi)	ASTM D790-15e2
Flexural Modulus	A. Lengthwise B. Crosswise	16.1 (2330) 13.0 (1885)	GPa (kpsi)	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	0.170 0.155	—	ASTM D3039
Moisture Absorption		0.10	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		160	°C	UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 10/23
B: Removed DSC Tg - 03/24

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	2 GHz	5 Ghz	10 Ghz	20 Ghz
Construction	Resin Content %	Offering	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x1035	67.0%	Standard	0.0020	0.051	3.64 0.0063	3.61 0.0064	3.60 0.0066	3.56 0.0064
1x1067	71.0%	Standard	0.0025	0.064	3.57 0.0064	3.55 0.0066	3.53 0.0067	3.49 0.0066
1x1078	65.0%	Standard	0.0030	0.076	3.67 0.0062	3.64 0.0064	3.63 0.0065	3.59 0.0064
1x1078	69.0%	Standard	0.0035	0.089	3.61 0.0064	3.58 0.0065	3.57 0.0067	3.53 0.0065
2x1035	67.0%	Alternate	0.0040	0.102	3.64 0.0063	3.61 0.0064	3.60 0.0066	3.56 0.0064
1x3313	56.0%	Standard	0.0040	0.102	3.82 0.0059	3.79 0.0060	3.78 0.0062	3.74 0.0060
1x2116	52.0%	Standard	0.0045	0.114	3.89 0.0057	3.86 0.0059	3.85 0.0060	3.81 0.0059
1x2116	55.0%	Standard	0.0050	0.127	3.84 0.0059	3.81 0.0060	3.80 0.0062	3.76 0.0060
2x1067	71.0%	Standard	0.0050	0.127	3.57 0.0064	3.55 0.0066	3.53 0.0067	3.49 0.0066
2x1078	65.0%	Standard	0.0060	0.152	3.67 0.0062	3.64 0.0064	3.63 0.0065	3.59 0.0064
2x1078	69.0%	Standard	0.0070	0.178	3.61 0.0064	3.58 0.0065	3.57 0.0067	3.53 0.0065
2x3313	56.0%	Standard	0.0080	0.203	3.82 0.0059	3.79 0.0060	3.78 0.0062	3.74 0.0060
2x2116	55.0%	Standard	0.0100	0.254	3.84 0.0059	3.81 0.0060	3.80 0.0062	3.76 0.0060
3x3313	56.0%	Standard	0.0120	0.305	3.82 0.0059	3.79 0.0060	3.78 0.0062	3.74 0.0060
3x2116	55.0%	Proposed	0.0150	0.038	3.84 0.0059	3.81 0.0060	3.80 0.0062	3.76 0.0060
4x2116	55.0%	Proposed	0.0200	0.508	3.84 0.0059	3.81 0.0060	3.80 0.0062	3.76 0.0060

Prepreg Data

Glass	Resin Content %	Offering	Thickness (mils)	Thickness (mm)	2 GHz	5 GHz	10 GHz	20 GHz
Glass	Resin Content %	Offering	Thickness (mils)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1035	67.0%	Standard	0.0020	0.051	3.64 0.0063	3.63 0.0064	3.62 0.0066	3.61 0.0064
1035	70.0%	Standard	0.0023	0.058	3.59 0.0064	3.58 0.0065	3.57 0.0067	3.56 0.0065
1035	74.0%	Standard	0.0027	0.069	3.53 0.0065	3.52 0.0067	3.51 0.0068	3.50 0.0067
1078	65.0%	Alternate	0.0031	0.079	3.67 0.0062	3.66 0.0064	3.65 0.0065	3.64 0.0064
1067	76.0%	Standard	0.0031	0.079	3.50 0.0066	3.49 0.0067	3.48 0.0069	3.47 0.0067
1078	67.0%	Standard	0.0033	0.084	3.64 0.0063	3.63 0.0064	3.62 0.0066	3.61 0.0064
1078	69.0%	Standard	0.0036	0.091	3.61 0.0064	3.60 0.0065	3.59 0.0067	3.58 0.0065
1078	71.0%	Standard	0.0039	0.099	3.57 0.0064	3.56 0.0066	3.55 0.0067	3.54 0.0066
3313	60.0%	Standard	0.0045	0.114	3.75 0.0060	3.74 0.0062	3.73 0.0063	3.72 0.0062
2116	55.0%	Standard	0.0050	0.127	3.84 0.0059	3.83 0.0060	3.82 0.0062	3.81 0.0060
2116	59.0%	Standard	0.0056	0.142	3.77 0.0060	3.76 0.0062	3.75 0.0063	3.74 0.0062

NOTE

Revisions:
A - Original-4/23
All IS580G glass is Spread Weave in both directions
Standard-Commonly available; Alternate-Available, but not stocked

Documentation ▼

Resource Title & Summary	Date Updated
IS580G Prepreg Supplemental	03/21/2024
IS580G Laminate Supplemental	03/21/2024
IS580G Prepreg RoHS Declaration	03/26/2024
IS580G Laminate RoHS Declaration	03/26/2024
IS580G Prepreg Safety Data Sheet	10/02/2023
IS580G Laminate Safety Data Sheet	10/02/2023
IS580G Processing Guide	03/20/2024

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Property		IS580G
Recommended for New Design
Halogen Free
Glass Transition Temperature (Tg) by DSC	Resin Content	—
Dk, Permittivity	Resin Content	3.8
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	385
Df, Loss Tangent	Resin Content	0.006
Moisture Absorption	Resin Content	0.10
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.8
Peel Strength	Standard profile copper >>> After thermal stress	0.75 (4.3)

IS580G

Halogen-free, Very Low Loss Material

IS580G is a halogen-free 205°C Tg resin system for multilayer PWB applications where maximum thermal performance and reliability are required.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

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