P95/P25

Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => — ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => — ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 260 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.73 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 416 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.021 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => 0.5 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 1.5 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 1.14 (6.5) ) [tg] => Array ( [value] => 260°C ) [td] => Array ( [value] => 416°C ) )

P95/P25

Polyimide UL HB Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 260°C Td: 416°C	Dk: 3.76 Df: 0.017	IPC-4101 /40 /41 UL - File Number E41625

Thermal Performance

Tg: 260°C
Td: 416°C

Electrical Performance

Dk: 3.76
Df: 0.017

Industry Approvals

IPC-4101 /40 /41

UL - File Number E41625

These products consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- Lead-free assembly compatible
- 6x 260°C reflow capable

Processing Advantages
- Via filling capability
- Multiple reflow capable
- Multiple lamination cycles

Production & Manufacturing

Currently manufactured in North America

Product Availability

Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)

Copper Foil Type
- HTE Grade 3

Copper Weight
- ½ to 3 oz (18 to 105 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Glass Fabric Availability
- E-glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		260	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		416	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. 50 to 260°C, (Total Expansion)	55 1.5	ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	13/14	ppm/°C	2.4.24C
Thermal Conductivity		0.4	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 100 MHz B. @ 500 MHz C. @ 1 GHz D. @ 2 GHz E. @ 5 GHz F. @ 10 GHz	3.83 3.80 3.78 3.76 3.73 3.73	—	2.5.5.9 2.5.5.9 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Df, Loss Tangent	A. @ 100 MHz B. @ 500 MHz C. @ 1 GHz D. @ 2 GHz E. @ 5 GHz F. @ 10 GHz	0.0135 0.0151 0.0172 0.0179 0.0188 0.021	—	2.5.5.9 2.5.5.9 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Volume Resistivity	A. After moisture resistance B. At elevated temperature	3.0 x 10⁸ 7.0 x 10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	A. After moisture resistance B. At elevated temperature	3.0 x 10⁶ 2.0 x 10⁸	MΩ	2.5.17.1
Dielectric Breakdown		>55	kV	2.5.6B
Arc Resistance		130	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		44 (1100)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		2 (250-399)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions	1.14 (6.5) 1.25 (7.0) 1.25 (7.0) 1.14 (6.5)	N/mm (lb/inch)	2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	456 (66.2) 405 (58.7)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	376 (54.5) 249 (36.1)	MPa (kpsi)	ASTM D3039
Young's Modulus	A. Length direction B. Cross direction	3892 3490	ksi	ASTM D790-15e2
Poisson's Ratio	A. Length direction B. Cross direction	0.187 0.164	—	ASTM D3039
Moisture Absorption		0.5	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		HB	Rating	UL 94
Relative Thermal Index (RTI)		140	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Corrected MOT value to match UL file - 11/18
D: Change MOT to RTI 5/19
E: Corrected Flex Strength. Values reversed 2/23

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 Ghz
Construction	Resin Content %	Standard/ Alternate	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x106	69.0%	Alternate	0.0020	0.051	3.58 0.0150	3.54 0.0170	3.52 0.0200	3.49 0.0210	3.46 0.0220	3.46 0.0240
1x106	73.0%	Standard	0.0025	0.064	3.51 0.0160	3.47 0.0180	3.45 0.0200	3.42 0.0210	3.39 0.0230	3.39 0.0250
1x1080	61.0%	Standard	0.0030	0.076	3.73 0.0140	3.69 0.0160	3.68 0.0180	3.65 0.0190	3.62 0.0200	3.62 0.0220
2x106	66.0%	Standard	0.0035	0.089	3.64 0.0150	3.60 0.0170	3.58 0.0190	3.55 0.0200	3.52 0.0210	3.52 0.0240
1x2116	43.0%	Standard	0.0040	0.102	4.16 0.0120	4.13 0.0130	4.13 0.0150	4.10 0.0150	4.07 0.0160	4.07 0.0180
106/1080	58.0%	Alternate	0.0042	0.107	3.78 0.0140	3.75 0.0160	3.73 0.0180	3.70 0.0190	3.68 0.0200	3.68 0.0220
106/1080	61.0%	Standard	0.0045	0.114	3.73 0.0140	3.69 0.0160	3.68 0.0180	3.65 0.0190	3.62 0.0200	3.62 0.0220
106/1080	64.0%	Alternate	0.0050	0.127	3.67 0.0150	3.64 0.0160	3.62 0.0190	3.59 0.0200	3.56 0.0210	3.56 0.0230
2x1080	56.0%	Standard	0.0050	0.127	3.83 0.0140	3.80 0.1520	3.79 0.0170	3.76 0.0180	3.74 0.0190	3.74 0.0210
106/2113	53.0%	Standard	0.0053	0.135	3.90 0.0130	3.86 0.0150	3.85 0.0170	3.82 0.0170	3.80 0.0180	3.80 0.0200
106/2116	49.0%	Standard	0.0060	0.152	3.99 0.0130	3.96 0.0140	3.94 0.0160	3.92 0.0170	3.89 0.0170	3.89 0.0190
1080/2116	51.0%	Standard	0.0070	0.178	3.94 0.0130	3.91 0.0140	3.89 0.0160	3.87 0.0170	3.84 0.0180	3.84 0.0200
2x1080/106	63.0%	Standard	0.0080	0.203	3.69 0.0140	3.65 0.0160	3.64 0.0190	3.61 0.0190	3.58 0.0200	3.58 0.0230
2113/2116	47.0%	Standard	0.0080	0.203	4.03 0.0120	4.00 0.0140	3.99 0.0160	3.97 0.0160	3.94 0.0170	3.94 0.0190
2x2113/106	54.0%	Standard	0.0090	0.229	3.88 0.0130	3.84 0.0150	3.83 0.0170	3.80 0.0180	3.78 0.0180	3.78 0.0210
2x1080/2116	54.0%	Standard	0.0100	0.254	3.88 0.0130	3.84 0.0150	3.83 0.0170	3.80 0.0180	3.78 0.0180	3.78 0.0210
1080/7628/1080	43.0%	Standard	0.0120	0.305	4.16 0.0120	4.13 0.0130	4.13 0.0150	4.10 0.0150	4.07 0.0160	4.07 0.0180
2x7628	39.0%	Standard	0.0140	0.356	4.23 0.0120	4.20 0.0120	4.19 0.0140	4.17 0.0150	4.11 0.0150	4.11 0.0170
2x7628/106	40.0%	Alternate	0.0160	0.406	4.18 0.0120	4.15 0.0130	4.15 0.0140	4.12 0.0150	4.09 0.0150	4.09 0.0170
2x7628/2113	41.0%	Alternate	0.0180	0.457	4.16 0.0120	4.13 0.0130	4.13 0.0150	4.10 0.0150	4.07 0.0160	4.07 0.0170
3x7628	38.0%	Alternate	0.0200	0.508	4.24 0.0120	4.21 0.0120	4.20 0.0140	4.16 0.0140	4.13 0.0150	4.13 0.0170
3x7628/2116	40.0%	Alternate	0.0240	0.610	4.18 0.0120	4.15 0.0130	4.15 0.0140	4.12 0.0150	4.09 0.0150	4.09 0.0170
4x7628	39.0%	Standard	0.0280	0.711	4.23 0.0120	4.20 0.0120	4.19 0.0140	4.14 0.0150	4.11 0.0150	4.11 0.0170
4x7628/2116	39.0%	Standard	0.0310	0.787	4.23 0.0110	4.20 0.0120	4.19 0.0140	4.14 0.0140	4.11 0.0150	4.11 0.0170
6x7628	37.0%	Standard	0.0390	0.991	4.24 0.0120	4.21 0.0120	4.21 0.0140	4.18 0.0150	4.15 0.0150	4.15 0.0170
1x2116/ 8x7628	38.0%	Standard	0.0590	1.499	4.24 0.0120	4.21 0.0120	4.20 0.0140	4.16 0.0140	4.13 0.0150	4.13 0.0170

Prepreg Data

Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 GHz	2 GHz	5 GHz	10 Ghz
Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
106	75.00%	0.0024	0.061	3.48 0.0158	3.43 0.0180	3.41 0.0208	3.38 0.0218	3.35 0.0229	3.35 0.0259
1080	65.00%	0.0032	0.081	3.66 0.0146	3.62 0.0165	3.60 0.0189	3.57 0.0198	3.54 0.0207	3.54 0.0233
2113	57.00%	0.004	0.102	3.81 0.0136	3.78 0.0153	3.76 0.0174	3.74 0.0181	3.71 0.0190	3.71 0.0212
2116	54.00%	0.005	0.127	3.88 0.0133	3.84 0.0148	3.83 0.0169	3.80 0.0175	3.78 0.0183	3.78 0.0205
7628	42.00%	0.0078	0.198	4.14 0.0119	4.11 0.0129	4.11 0.0149	4.08 0.0151	4.05 0.0158	4.05 0.0175

NOTE

Revisions:
A-Original-4/17
B-Modified construction offering 6/19
C-Correct 31 mil core thickness 9/19
D-Corrected 20 mil construction 7/20
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time

Documentation ▼

Resource Title & Summary	Date Updated
P95 Laminate RoHS Declaration	03/20/2024
P25 Prepreg Supplemental	03/20/2024
Isola Laminate Outgassing Data Properties	03/22/2024
P95/P25 Processing Guide	06/30/2020
P25 Prepreg Safety Data Sheet	02/16/2021
P95 Laminate Safety Data Sheet	02/16/2021
P95 Laminate Supplemental	03/20/2024
P25 Prepreg RoHS Declaration	03/20/2024

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Property		P95/P25
Recommended for New Design		—
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	260
Dk, Permittivity	Resin Content	3.73
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	416
Df, Loss Tangent	Resin Content	0.021
Moisture Absorption	Resin Content	0.5
Z-Axis CTE	50 to 260°C, (Total Expansion)	1.5
Peel Strength	Standard profile copper >>> After thermal stress	1.14 (6.5)

P95/P25

Polyimide UL HB Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

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