P95/P25

Polyimide UL HB Laminate and Prepreg

Isola offers a product line of polyimide-based prepreg (P25) and core material (P95) for high temperature printed circuit applications.

Thermal Performance

Tg: 260°C
Td: 416°C

Electrical Performance

Dk: 3.76
Df: 0.017

Industry Approvals

IPC-4101 /40 /41
UL - File Number E41625

These products consist of an HB flammability rated polyimide resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties. These products utilize a polyimide and thermoplastic blend resin, fully cured without the use of MDA (Methylenedianiline). This results in a polymer with a high Tg without the characteristic difficulties of brittleness and low initial bond strength associated with traditional thermoset polyimides.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
    • 6x 260°C reflow capable
  • Processing Advantages
    • Via filling capability
    • Multiple reflow capable
    • Multiple lamination cycles

Production & Manufacturing

Currently manufactured in North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 125 mil (0.05 to 3.2 mm)
  • Copper Foil Type
    • HTE Grade 3
  • Copper Weight
    • ½ to 3 oz (18 to 105 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 260 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 416 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. 50 to 260°C, (Total Expansion)
55
1.5
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13/14 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
3.83
3.80
3.78
3.76
3.73
3.73
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
F. @ 10 GHz
0.0135
0.0151
0.0172
0.0179
0.0188
0.021
2.5.5.9
2.5.5.9
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 108
7.0 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
3.0 x 106
2.0 x 108
2.5.17.1
Dielectric Breakdown >55 kV 2.5.6B
Arc Resistance 130 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 44 (1100) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.14 (6.5)

1.25 (7.0)
1.25 (7.0)
1.14 (6.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
456 (66.2)
405 (58.7)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
376 (54.5)
249 (36.1)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3892
3490
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.187
0.164
ASTM D3039
Moisture Absorption 0.5 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) HB Rating UL 94
Relative Thermal Index (RTI) 140 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Corrected MOT value to match UL file - 11/18
D: Change MOT to RTI 5/19
E: Corrected Flex Strength. Values reversed 2/23

Core Data

Construction Resin Content % Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
1x106 69.0% Alternate 0.0020 0.051 3.58
0.0150
3.54
0.0170
3.52
0.0200
3.49
0.0210
3.46
0.0220
3.46
0.0240
1x106 73.0% Standard 0.0025 0.064 3.51
0.0160
3.47
0.0180
3.45
0.0200
3.42
0.0210
3.39
0.0230
3.39
0.0250
1x1080 61.0% Standard 0.0030 0.076 3.73
0.0140
3.69
0.0160
3.68
0.0180
3.65
0.0190
3.62
0.0200
3.62
0.0220
2x106 66.0% Standard 0.0035 0.089 3.64
0.0150
3.60
0.0170
3.58
0.0190
3.55
0.0200
3.52
0.0210
3.52
0.0240
1x2116 43.0% Standard 0.0040 0.102 4.16
0.0120
4.13
0.0130
4.13
0.0150
4.10
0.0150
4.07
0.0160
4.07
0.0180
106/1080 58.0% Alternate 0.0042 0.107 3.78
0.0140
3.75
0.0160
3.73
0.0180
3.70
0.0190
3.68
0.0200
3.68
0.0220
106/1080 61.0% Standard 0.0045 0.114 3.73
0.0140
3.69
0.0160
3.68
0.0180
3.65
0.0190
3.62
0.0200
3.62
0.0220
106/1080 64.0% Alternate 0.0050 0.127 3.67
0.0150
3.64
0.0160
3.62
0.0190
3.59
0.0200
3.56
0.0210
3.56
0.0230
2x1080 56.0% Standard 0.0050 0.127 3.83
0.0140
3.80
0.1520
3.79
0.0170
3.76
0.0180
3.74
0.0190
3.74
0.0210
106/2113 53.0% Standard 0.0053 0.135 3.90
0.0130
3.86
0.0150
3.85
0.0170
3.82
0.0170
3.80
0.0180
3.80
0.0200
106/2116 49.0% Standard 0.0060 0.152 3.99
0.0130
3.96
0.0140
3.94
0.0160
3.92
0.0170
3.89
0.0170
3.89
0.0190
1080/2116 51.0% Standard 0.0070 0.178 3.94
0.0130
3.91
0.0140
3.89
0.0160
3.87
0.0170
3.84
0.0180
3.84
0.0200
2x1080/106 63.0% Standard 0.0080 0.203 3.69
0.0140
3.65
0.0160
3.64
0.0190
3.61
0.0190
3.58
0.0200
3.58
0.0230
2113/2116 47.0% Standard 0.0080 0.203 4.03
0.0120
4.00
0.0140
3.99
0.0160
3.97
0.0160
3.94
0.0170
3.94
0.0190
2x2113/106 54.0% Standard 0.0090 0.229 3.88
0.0130
3.84
0.0150
3.83
0.0170
3.80
0.0180
3.78
0.0180
3.78
0.0210
2x1080/2116 54.0% Standard 0.0100 0.254 3.88
0.0130
3.84
0.0150
3.83
0.0170
3.80
0.0180
3.78
0.0180
3.78
0.0210
1080/7628/1080 43.0% Standard 0.0120 0.305 4.16
0.0120
4.13
0.0130
4.13
0.0150
4.10
0.0150
4.07
0.0160
4.07
0.0180
2x7628 39.0% Standard 0.0140 0.356 4.23
0.0120
4.20
0.0120
4.19
0.0140
4.17
0.0150
4.11
0.0150
4.11
0.0170
2x7628/106 40.0% Alternate 0.0160 0.406 4.18
0.0120
4.15
0.0130
4.15
0.0140
4.12
0.0150
4.09
0.0150
4.09
0.0170
2x7628/2113 41.0% Alternate 0.0180 0.457 4.16
0.0120
4.13
0.0130
4.13
0.0150
4.10
0.0150
4.07
0.0160
4.07
0.0170
3x7628 38.0% Alternate 0.0200 0.508 4.24
0.0120
4.21
0.0120
4.20
0.0140
4.16
0.0140
4.13
0.0150
4.13
0.0170
3x7628/2116 40.0% Alternate 0.0240 0.610 4.18
0.0120
4.15
0.0130
4.15
0.0140
4.12
0.0150
4.09
0.0150
4.09
0.0170
4x7628 39.0% Standard 0.0280 0.711 4.23
0.0120
4.20
0.0120
4.19
0.0140
4.14
0.0150
4.11
0.0150
4.11
0.0170
4x7628/2116 39.0% Standard 0.0310 0.787 4.23
0.0110
4.20
0.0120
4.19
0.0140
4.14
0.0140
4.11
0.0150
4.11
0.0170
6x7628 37.0% Standard 0.0390 0.991 4.24
0.0120
4.21
0.0120
4.21
0.0140
4.18
0.0150
4.15
0.0150
4.15
0.0170
1x2116/ 8x7628 38.0% Standard 0.0590 1.499 4.24
0.0120
4.21
0.0120
4.20
0.0140
4.16
0.0140
4.13
0.0150
4.13
0.0170

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 Ghz
106 75.00% 0.0024 0.061 3.48
0.0158
3.43
0.0180
3.41
0.0208
3.38
0.0218
3.35
0.0229
3.35
0.0259
1080 65.00% 0.0032 0.081 3.66
0.0146
3.62
0.0165
3.60
0.0189
3.57
0.0198
3.54
0.0207
3.54
0.0233
2113 57.00% 0.004 0.102 3.81
0.0136
3.78
0.0153
3.76
0.0174
3.74
0.0181
3.71
0.0190
3.71
0.0212
2116 54.00% 0.005 0.127 3.88
0.0133
3.84
0.0148
3.83
0.0169
3.80
0.0175
3.78
0.0183
3.78
0.0205
7628 42.00% 0.0078 0.198 4.14
0.0119
4.11
0.0129
4.11
0.0149
4.08
0.0151
4.05
0.0158
4.05
0.0175

NOTE

Revisions:
A-Original-4/17
B-Modified construction offering 6/19
C-Correct 31 mil core thickness 9/19
D-Corrected 20 mil construction 7/20
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time

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Laminates, Prepreg, & PCB Materials

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