Tachyon® 100G

Ultra Low Loss Laminate and Prepreg

Tachyon 100G laminate materials are designed for very high-speed digital applications up to and beyond data rates of 100 Gb/s.

Thermal Performance

Tg: 200°C
Td: 360°C

Electrical Performance

Dk: 3.02
Df: 0.0021

Industry Approvals

IPC-4103 /17
IPC-4101 /102
UL - File Number E41625

Tachyon 100G materials exhibit exceptional electrical properties that are very stable over a broad frequency and temperature range between -55°C and +125°C up to 100 GHz. These electrical properties provide designers a scalable solution for next generation designs of backplanes and daughter cards, enabling 10x improvements from 10 Gb/s data rates.

Isola has developed Tachyon 100G with the highest level of thermal performance for high layer count line cards. The very low Z-axis CTE makes it a perfect choice for fine pitch BGA applications of 0.8 mm or less.  The material is optimized with the use of spread glass to mitigate skew, improve rise times, reduce jitter, and increase eye width/height and that use ultra smooth HVLP (VLP2) 2um Rz copper that significantly reduces conductor losses.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia, North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is Standard
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Moisture barrier packaging
  • Glass Fabric Availability
    • Low Dk Glass -Asahi Japan, Asahi Tawian, TGI Taiwan
    • Square weave glass
    • Mechanically spread glass
PropertyTypical ValueUnitsTest Method
Metric (English)IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 220 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
C. T300
>60
>60
>20
Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
250
2.5
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 15 ppm/°C 2.4.24C
Thermal Conductivity 0.42 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
3.04
3.02
3.02
2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0021 2.5.5.5
Volume Resistivity C-96/35/90 1.33x107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33x105 2.5.17.1
Dielectric Breakdown 60 kV 2.5.6B
Arc Resistance 125 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 60 (1500) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
B. Standard profile copper
    1. After thermal stress
0.79 (4.5)

0.96 (5.5)
N/mm (lb/inch)
2.4.8C

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
44.0
41.0
ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
30.0
25.0
ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
2,551
2,417
ksi ASTM D790-15e2
Taylor's Modulus
A. Length direction
B. Cross direction
2,264
2,197
ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.165
0.156
ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected moisture uptake value 6/18
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI - 5/19
E: Changed VLP2 to HVLP to align with common industry terms 4/21

Core Data

ConstructionResin Content %OfferingThickness (inch)Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
1 GHz2 Ghz5 Ghz10 GHz15 Ghz20 Ghz
1x106766.5%Standard0.00200.0513.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
1x103573.5%Standard0.00250.0642.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
1x107866.0%Standard0.00300.0763.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
1x107870.5%Standard0.00350.0893.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
2x103567.5%Alternate0.00400.1023.07
0.0017
3.07
0.0017
3.07
0.0017
3.07
0.0017
3.07
0.0017
3.07
0.0017
1x331358.5%Standard0.00400.1023.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
2x106766.5%Standard0.00400.1023.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
2x106770.0%Standard0.00450.1143.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
2x107860.0%Standard0.00500.1273.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
1x331366.0%Alternate0.00500.1273.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
2x106772.5%Standard0.00500.1272.98
0.0014
2.98
0.0014
2.98
0.0015
2.98
0.0015
2.98
0.0015
2.98
0.0015
2x107866.0%Standard0.00600.1523.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
2x107870.5%Standard0.00700.1783.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
2x331358.5%Standard0.00800.2033.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
2x331363.5%Alternate0.00900.2293.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3x107868.5%Standard0.01000.2543.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
2x331366.0%Alternate0.01000.2543.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3x331358.5%Standard0.01200.3053.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
3.24
0.0022
2x3313/107866.5%Alternate0.01330.3383.10
0.0018
3.10
0.0018
3.10
0.0018
3.10
0.0018
3.10
0.0018
3.10
0.0018
3x331362.5%Standard0.01400.3563.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
3.15
0.0020
4x211657.0%Standard0.02000.5083.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022
3.25
0.0022

Prepreg Data

Glass StyleResin Content %OfferingThickness (inch)Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
1 GHz2 Ghz5 Ghz10 GHz15 Ghz20 Ghz
103569.0%Standard0.00200.0513.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
3.06
0.0017
106770.0%Standard0.00220.0563.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
3.05
0.0017
10676.0%Standard0.00230.0582.95
0.0013
2.95
0.0013
2.95
0.0014
2.95
0.0014
2.95
0.0014
2.95
0.0014
106771.5%Standard0.00240.0613.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
103575.0%Standard0.00260.0662.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
106774.0%Standard0.00260.0662.98
0.0014
2.98
0.0014
2.98
0.0015
2.98
0.0015
2.98
0.0015
2.98
0.0015
106776.5%Standard0.00290.0742.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
2.94
0.0013
107865.0%Standard0.00290.0743.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019
107867.5%Standard0.00310.0793.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
3.09
0.0018
107870.5%Standard0.00350.0893.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
3.04
0.0016
108072.0%Standard0.00380.0973.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
107872.0%Standard0.00370.0943.02
0.0015
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.02
0.0016
3.01
0.0016
107875.0%Standard0.00420.1072.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
108075.0%Standard0.00430.1092.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
2.97
0.0014
108078.0%Alternate0.00460.1172.92
0.0013
2.92
0.0013
2.92
0.0014
2.92
0.0014
2.92
0.0014
2.92
0.0014
107878.0%Alternate0.00460.1172.92
0.0013
2.92
0.0013
2.92
0.0014
2.92
0.0014
2.92
0.0014
2.92
0.0014
331363.5%Standard0.00460.1173.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
3.16
0.0020
331366.5%Standard0.00510.1293.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
3.11
0.0018
211662.0%Standard0.00580.1473.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
3.19
0.0021
211665.0%Alternate0.00640.1633.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019
3.14
0.0019

NOTE

Revisions:
A - Original-4/17
B - Adjusted prepreg thickness values-6/18
C - Added Standard & Alternate construction-8/18;
D - Added 9 mil core 5/19
E - Optimized construction set 6/19
F - Clarified Weave and Offering, eliminated low Frequency data 1/20
G - Removed Weave Type 9/20

All Tachyon 100G glass is Spread Weave in both directions
Standard-Commonly available; Alternate-Available, but not stocked

Resources

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model

This presentation outlines practical fiber weave effect model for skew and jitter.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials
    Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.