TerraGreen® 400G

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, extremely low loss design solution.

Thermal Performance

Tg: 210°C
Td: 400°C

Electrical Performance

Dk: 3.05
Df: 0.0018

Industry Approvals

UL - File Number E41625

TerraGreen® 400G is our Halogen Free material solution for next generation 5G infrastructure and computing applications. Our novel resin system has been engineered for high data rates with excellent cost for loss performance.

TerraGreen® 400G is lead free compatible and can be processed utilizing standard PCB equipment and processing steps.

TerraGreen®  400G meets UL 94 V-0 and is halogen free.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
  • Processing Advantages
    • FR-4 process compatible
    • Excellent fill and flow for heavy copper

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HLVP3 (VLP1) ≤1.1 micron Rz JIS, 1/2 and 1 oz
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DMA 210 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 400 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) T288 60+ Minutes 2.4.24.1
Z-Axis CTE 50 to 260°C, (Total Expansion) 2.8 * % 2.4.24C
X/Y-Axis CTE Pre-Tg 12 * ppm/°C 2.4.24C
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity @ 10 GHz 3.05 Bereskin Stripline
Df, Loss Tangent @ 10 GHz 0.0018 Bereskin Stripline
Peel Strength Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil]
0.65 (3.9)
N/mm (lb/inch) 2.4.8C
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate

Revisions:
A: Preliminary Release

Core Data

Construction Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
5 Ghz 10 GHz 15 Ghz 20 Ghz 28 Ghz SE 28 Ghz D
1x1035 65.0% Standard 0.0020 0.051 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.10
0.0019
2.90
0.0017
1x1035 71.0% Standard 0.0025 0.064 3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x1078 63.0% Standard 0.0030 0.076 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017
1x1078 68.0% Standard 0.0035 0.089 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x1027/1x1035 67.0% Alternate 0.0035 0.089 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x1078 71.0% Standard 0.0040 0.102 3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
2x1035 65.0% Standard 0.0040 0.102 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017
1x1035/1x1067 65.0% Alternate 0.0040 0.102 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017
1x3313 57.0% Standard 0.0040 0.102 3.40
0.0020
3.40
0.0020
3.40
0.0020
3.30
0.0020
3.30
0.0020
3.10
0.0018
2x1035 68.0% Standard 0.0045 0.114 3.20
0.0019
3.20
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x1067/1x1035 68.0% Alternate 0.0045 0.114 3.20
0.0019
3.20
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x1078 74.0% Alternate 0.0045 0.114 3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x3313 61.0% Standard 0.0045 0.114 3.30
0.0019
3.30
0.0019
3.30
0.0019
3.30
0.0019
3.20
0.0019
3.00
0.0017
2x1035 71.0% Standard 0.0050 0.127 3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1035/1067 72.0% Alternate 0.0050 0.127 3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
1x3313 64.0% Standard 0.0050 0.127 3.30
0.0019
3.30
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017
2x1078 63.0% Standard 0.0060 0.152 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017
2x1078 68.0% Standard 0.0070 0.178 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.10
0.0019
3.10
0.0019
2.90
0.0017
2x3313 57.0% Standard 0.0080 0.203 3.40
0.0020
3.40
0.0020
3.40
0.0020
3.30
0.0020
3.30
0.0020
3.10
0.0018
3x1078 65.0% Standard 0.0100 0.254 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.00
0.0017

Prepreg Data

Glass Resin Content % Offering Thickness (mils) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
5 Ghz 10 GHz 15 GHz 20 GHz 28 GHz
1035 65.0% Standard 0.0020 0.051 3.20
0.0018
3.20
0.0018
3.20
0.0018
3.20
0.0018
3.20
0.0018
1035 71.0% Standard 0.0025 0.064 3.10
0.0015
3.10
0.0015
3.10
0.0015
3.10
0.0015
3.10
0.0015
1035 75.0% Standard 0.0030 0.076 3.10
0.0014
3.00
0.0014
3.00
0.0014
3.00
0.0014
3.00
0.0014
1078 63.0% Standard 0.0030 0.076 3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
1078 67.5% Standard 0.0035 0.089 3.20
0.0017
3.20
0.0017
3.20
0.0017
3.10
0.0017
3.10
0.0017
1078 71.0% Standard 0.0040 0.102 3.10
0.0017
3.10
0.0015
3.10
0.0015
3.10
0.0015
3.10
0.0015
1078 74.0% Standard 0.0045 0.114 3.10
0.0015
3.10
0.0015
3.10
0.0015
3.00
0.0015
3.00
0.0015
1080 74.5% Standard 0.0046 0.117 3.10
0.0014
3.10
0.0014
3.00
0.0014
3.00
0.0014
3.30
0.0014
3313 60.5% Standard 0.0045 0.114 3.30
0.0020
3.30
0.0020
3.30
0.0020
3.30
0.0020
3.30
0.0020
3313 64.5% Standard 0.0051 0.130 3.20
0.0018
3.20
0.0018
3.20
0.0018
3.20
0.0018
3.20
0.0018
3313 67.5% Standard 0.0057 0.145 3.20
0.0017
3.20
0.0017
3.20
0.0017
3.20
0.0017
3.20
0.0017
2116 60.5% Standard 0.0058 0.147 3.30
0.0020
3.30
0.0020
3.30
0.0020
3.30
0.0020
3.30
0.0020
2116 63.5% Standard 0.0064 0.163 3.30
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019
3.20
0.0019

NOTE

***ALL DATA IS PRELIMINARY AND SUBJECT TO CHANGE AS ADDITIONAL DATA BECOMES AVAILABLE***

Revisions:
A - Original 1/2020
"Standard" - Commonly available with the best availability.
"Alternate" - Available, but not stocked with longer lead time
All TerraGreen 400G glass is Spread in both directions
Stripline structure
Balance 100 um/4 mil dielectrics. 1 oz copper
LW 100 um/4 mil
Differential Structure
Balance 100 um/4 mil dielectrics. 1 oz copper
LW 100 um/4 mil Space 250 um/10 mil

Resource Title & Summary Date Updated
TerraGreen® 400G Prepreg Supplemental 12/15/2021
TerraGreen® 400G Laminate Supplemental 12/15/2021

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Laminates, Prepreg, & PCB Materials
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