DE104

Low Tg Laminate and Prepreg

DE104 offers excellent thermal resistance, due to its special resin system and a low coefficient of thermal expansion in the Z-axis.

Download Data Sheet Contact Us

Thermal Performance

Tg: 135°C
Td: 315°C

Electrical Performance

Dk: 4.37
Df: 0.022

Industry Approvals

IPC-4101 /21
UL - File Number E41625

The glass transition temperature (Tg) is 135°C (DSC). Time to delamination of the laminate at a temperature of 260°C is 12 minutes and the decomposition temperature (Td) is 315°C. The product is listed as FR-4 and can be processed using standard parameters. DE104 multilayer (ML) corresponds to NEMA-grade FR-4 and meets the requirements of IPC-4101.

Attributes

Asset 7

Markets

AutomotiveTransportation ConsumerElectronics MedicalIndustrialInstrumentation

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 93 mil (0.05 to 2.4 mm)
  • Copper Foil Type
    • HTE Grade 3
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Roll or panel form
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 135 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 315 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed) T260 12 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
70
250
4.2
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 16/13 ppm/°C 2.4.24C
Thermal Conductivity 0.36 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
4.46
4.40
4.37
4.35
4.32
 —
2.5.5.3
2.5.5.3
2.5.5.9
2.5.5.5
2.5.5.5
Df, Loss Tangent
A. @ 100 MHz
B. @ 500 MHz
C. @ 1 GHz
D. @ 2 GHz
E. @ 5 GHz
0.020
0.021
0.022
0.023
0.024
 —
2.5.5.3
2.5.5.3
2.5.5.9
2.5.5.5
2.5.5.5
Volume Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
—
1.3 x 106
3.4 x 107
 MΩ-cm 2.5.17.1
Surface Resistivity
A. C-96/35/90
B. After moisture resistance
C. At elevated temperature
—
1.0 x 106
7.2 x 106
 MΩ 2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 105 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 54 (1350) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A.
B. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
    3. After process solutions

1.23 (7.0)

1.58 (9.0)
1.23 (7.0)
1.58 (9.0)
 N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
579 (84.0)
450 (65.2)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
393 (57.0)
292 (42.4)
 MPa (kpsi) ASTM D3039
Moisture Absorption 0.3 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 94
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B; Correct 5GHz Df label - 8-17
C: Corrected units for Flexural and Tensile Strength - 8/18
D: Change MOT to RTI 5/19

Download Dk/Df Tables PDF

Core Data

Construction Resin Content% Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz
1 x 106 74% 0.002 0.05 4.07
0.0180		 4.03
0.0210		 4.01
0.0240		 3.96
0.0250		 3.89
0.0260
1 x 1080 61% 0.003 0.08 4.29
0.0170		 4.25
0.0190		 4.23
0.0210		 4.19
0.0220		 4.13
0.0220
1 x 2116 45% 0.004 0.10 4.61
0.0140		 4.58
0.0160		 4.56
0.0180		 4.54
0.0180		 4.47
0.0180
1 x 1652 42% 0.005 0.13 4.67
0.0140		 4.64
0.0150		 4.62
0.0170		 4.60
0.0180		 4.55
0.0180
1 x 1652 50% 0.006 0.15 4.50
0.0150		 4.46
0.0170		 4.45
0.0190		 4.42
0.0200		 4.36
0.0200
1 x 7628 39% 0.007 0.18 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
1 x 7628 44% 0.008 0.20 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
2 x 2165 47% 0.010 0.25 4.52
0.0140		 4.48
0.0160		 4.47
0.0180		 4.44
0.0190		 4.39
0.0190
2 x 1652 42% 0.010 0.25 4.67
0.0140		 4.64
0.0150		 4.62
0.0170		 4.60
0.0180		 4.55
0.0180
2 x 1652 50% 0.012 0.30 4.50
0.0150		 4.46
0.0170		 4.45
0.0190		 4.42
0.0200		 4.36
0.0200
2 x 7628 39% 0.014 0.36 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
2 x 7628 41% 0.015 0.38 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
2 x 7628 44% 0.016 0.41 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
2x7628, 1x2116 42% 0.018 0.46 4.67
0.0140		 4.64
0.0150		 4.62
0.0170		 4.60
0.0180		 4.55
0.0180
3 x 7628 38% 0.020 0.51 4.74
0.0130		 4.70
0.0150		 4.69
0.0160		 4.67
0.0170		 4.60
0.0170
3 x 7628 41% 0.022 0.56 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
3 x 7628 44% 0.024 0.61 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
4 x 7628 39% 0.028 0.71 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
4 x 7628 41% 0.030 0.76 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
4 x 7628 44% 0.031 0.80 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
5 x 7628 39% 0.035 0.90 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
5 x 7628 41% 0.038 0.96 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
5 x 7628 44% 0.039 1.00 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
6 x 7628 39% 0.043 1.08 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
6 x 7628 44% 0.047 1.20 4.58
0.0150		 4.56
0.0160		 4.53
0.0170		 4.51
0.0180		 4.46
0.0180
8 x 7628 39% 0.057 1.46 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
8 x 7628 42% 0.060 1.52 4.67
0.0140		 4.64
0.0150		 4.62
0.0170		 4.60
0.0180		 4.55
0.0180
9 x 7628 39% 0.061 1.55 4.72
0.0130		 4.68
0.0150		 4.67
0.0170		 4.65
0.0170		 4.56
0.0170
10 x 7628 41% 0.076 1.93 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
11 x 7628 41% 0.079 2.00 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
13 x 7628 41% 0.094 2.40 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
16 x 7628 41% 0.118 3.00 4.70
0.0140		 4.66
0.0150		 4.65
0.0170		 4.62
0.0170		 4.57
0.0180
18 x 7628 40% 0.126 3.20 4.71
0.0140		 4.67
0.0150		 4.66
0.0170		 4.63
0.0170		 4.58
0.0170

Prepreg Data

Glass Style Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz
106 73% 0.0023 0.058 4.10
0.0180		 4.04
0.0210		 4.02
0.0240		 3.98
0.0250		 3.91
0.0250
1080 64% 0.0030 0.077 4.44
0.0170		 4.20
0.0190		 4.18
0.0220		 4.12
0.0230		 4.07
0.0230
1080 72% 0.0040 0.102 4.11
0.0180		 4.05
0.0210		 4.03
0.0240		 4.00
0.0250		 3.92
0.0250
2113 54% 0.0039 0.100 4.43
0.0150		 4.39
0.0170		 4.37
0.0200		 4.34
0.0210		 4.27
0.0210
2125 53% 0.0041 0.105 4.44
0.0150		 4.41
0.0170		 4.39
0.0200		 4.36
0.0200		 4.29
0.0200
2125 62% 0.0053 0.134 4.28
0.0170		 4.23
0.0190		 4.21
0.0220		 4.18
0.0220		 4.11
0.0230
2116 50% 0.0047 0.120 4.50
0.0150		 4.46
0.0170		 4.45
0.0190		 4.42
0.0200		 4.36
0.0200
2116 57% 0.0054 0.138 4.37
0.0160		 4.33
0.0180		 4.31
0.0200		 4.27
0.0210		 4.21
0.0210
7628 45% 0.0078 0.198 4.61
0.0140		 4.58
0.0160		 4.56
0.0180		 4.54
0.0180		 4.47
0.0180
7628 50% 0.0088 0.223 4.50
0.0150		 4.46
0.0170		 4.45
0.0190		 4.42
0.0200		 4.36
0.0200

NOTE

Revision:

A - Initial web release 03/21

Resources

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials

    Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.