High-performance laminate materials are used in a variety of advanced electronics, including high-end consumer electronics. The increasingly complex performance and environmental requirements of today’s smart devices are driving greater demand for higher performance PCBs, which require laminate materials with resins specifically formulated to satisfy demanding performance criteria.
Moisture Absorption Properties of Laminates Used in Chip Packaging Applications
This paper discusses how plastic laminates are increasingly used as interposers within chip packaging applications.
Halogen Free Base Materials for PWB Applications
This paper discusses the challenges and concerns of commercially-available non-halogen materials.
Re-engineered FR-4 Base Materials for Improved Multilayer PCB Performance
This paper discusses the continuing evolution of FR-4 base materials.
New Low Dielectric Constant, High Tg, Printed Circuitry Substrates
This paper discusses new technologies presenting results of PCB fabrication techniques for these materials as well as the benefits to the end users.
Lead Free Assembly: A Practical Tool For Laminate Materials Selection
This paper defines a “best practice” methodology to be used in determining selection criteria for lead-free assembly materials.
Conductive Anodic Filament Growth Failure
This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.
Coated Copper Foils for High Density Interconnects
This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.
An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability
This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.
Signal Integrity Considerations in High-Reliability Designs
This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.
New Thermoset PCB Material Emerging for mmWave Applications
This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.
Thermal Management of PCBs in Embedded Systems
This presentation discusses thermal management considerations for embedded systems.
SITV’s Stack-ups and Loss
This presentation outlines SITV stack-ups general, loss characterization and balancing resin content.
Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model
This presentation outlines practical fiber weave effect model for skew and jitter.
PIM in PCBs: Mechanisms & Mitigation
This presentation describes the sources & physical mechanisms of PIM in communication systems.
PCB Material Selection for High-speed Digital Designs
This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.
Passive Intermodulation (PIM) in PCBs
This presentation the sources of Passive Intermodulation in PCBs and how to measure it.
Meeting Flame Resistance Requirements for Green Electronics
This presentation discusses challenges and opportunities for halogen-free laminates.
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