IS410

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IS410

Lead-free Epoxy Laminate and Prepreg

IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 180°C Td: 350°C	Dk: 3.97 Df: 0.0200	IPC-4101 /21 /24 /26 /121 /124 /129 UL - File Number E41625

Thermal Performance

Tg: 180°C
Td: 350°C

Electrical Performance

Dk: 3.97
Df: 0.0200

Industry Approvals

IPC-4101 /21 /24 /26 /121 /124 /129

UL - File Number E41625

Isola’s IS410 has a glass transition temperature (Tg) of 180°C and is specially formulated for superior performance through multiple thermal excursions, passing 6X solder tests at 288°C. IS410 is optimized for enhanced drilling performance allowing high aspect ratio holes of ≤10 mils. Its unique resin chemistry provides CAF resistance with the benefit of long-term reliability of boards built with small feature designs.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- Lead-free assembly compatible
- 6x 288°C solder float capable

Processing Advantages
- FR-4 process compatible

Production & Manufacturing

Currently manufactured in Europe

Product Availability

Standard Material Offering: Laminate
- 2 to 125 mil (0.05 to 3.2 mm)

Copper Foil Type
- HTE Grade 3
- RTF (Reverse Treat Foil)

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels

Glass Fabric Availability
- E-glass
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		180	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		350	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	50 10	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	55 250 3.5	ppm/°C ppm/°C %	2.4.24C 2.4.24C
X/Y-Axis CTE	Pre-Tg	11	ppm/°C	2.4.24C
Thermal Conductivity		0.5	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	3.96 3.90 3.97 3.87 3.87	—	2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Df, Loss Tangent	A. @ 100 MHz B. @ 1 GHz C. @ 2 GHz D. @ 5 GHz E. @ 10 GHz	0.0149 0.0189 0.0200 0.0230 0.0230	—	2.5.5.3 2.5.5.9 Bereskin Stripline Bereskin Stripline Bereskin Stripline
Volume Resistivity	A. After moisture resistance B. At elevated temperature	8.0 x 10⁸ 3.6 x 10⁸	MΩ-cm	2.5.17.1
Surface Resistivity	A. After moisture resistance B. At elevated temperature	8.0 x 10⁶ 4.5 x 10(8)	MΩ	2.5.17.1
Dielectric Breakdown		>50	kV	—
Arc Resistance		129	Seconds	—
Electric Strength (Laminate & laminated prepreg)		44 (1100)	kV/mm (V/mil)	—
Comparative Tracking Index (CTI)		3 (175-249)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	A. Low profile copper foil and very low profile copper foil all copper foil >17 μm [0.669 mil] B. Standard profile copper 1. After thermal stress 2. At 125ºC (257ºF) 3. After process solutions	1.14 (6.5) 1.225 (7.0) 1.14 (6.5) 0.90 (5.1)	N/mm (lb/inch)	2.4.8C 2.4.8.2A 2.4.8.3 2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	570 (82.6) 458 (66.4)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	420 (60.9) 316 (45.8)	MPa (kpsi)	ASTM D3039
Poisson's Ratio	A. Length direction B. Cross direction	0.175 0.143	—	ASTM D3039
Moisture Absorption		0.20	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		130	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Removed Asia as production site 9/24

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Construction	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 Ghz	2 GHz	5 Ghz	10 GHz
Construction	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1x106	70.0%	0.0020	0.051	3.59 0.0178	3.54 0.0203	3.51 0.0234	3.48 0.0240	3.40 0.0290	3.40 0.0290
1x1080	57.0%	0.0025	0.064	3.83 0.0158	3.79 0.0178	3.77 0.0205	3.74 0.0210	3.67 0.0250	3.67 0.0250
1x1080	63.0%	0.0030	0.076	3.71 0.0167	3.67 0.0189	3.65 0.0217	3.62 0.0230	3.54 0.0270	3.56 0.0270
1x2113	46.0%	0.0030	0.076	4.08 0.0141	4.04 0.0156	4.02 0.0177	3.99 0.0180	3.93 0.0210	3.93 0.0210
1x2113	51.0%	0.0035	0.089	3.96 0.0171	3.92 0.0193	3.90 0.0222	3.87 0.0230	3.81 0.0270	3.81 0.0270
2x106	65.0%	0.0035	0.089	3.68 0.0149	3.63 0.0166	3.61 0.0189	3.58 0.0200	3.50 0.0230	3.50 0.0230
1x2116	45.0%	0.0040	0.102	4.10 0.0139	4.06 0.0154	4.05 0.0175	4.02 0.0180	3.96 0.0210	3.96 0.0210
1x2116	49.0%	0.0043	0.109	4.01 0.0134	3.97 0.0149	3.95 0.0167	3.92 0.0170	3.86 0.0200	3.86 0.0200
106/1080	60.0%	0.0043	0.109	3.77 0.0163	3.73 0.0183	3.71 0.0210	3.68 0.0220	3.60 0.0260	3.60 0.0260
1x1652	42.0%	0.0050	0.127	4.17 0.0156	4.14 0.0176	4.12 0.0203	4.10 0.0210	4.04 0.0250	4.04 0.0250
106/2113	56.0%	0.0053	0.135	3.85 0.0152	3.81 0.0170	3.79 0.0194	3.76 0.0200	3.69 0.0240	3.69 0.0240
1080/2113	53.0%	0.0060	0.152	3.92 0.0133	3.88 0.0147	3.86 0.0165	3.83 0.0170	3.76 0.0200	3.76 0.0200
2113/2116	51.0%	0.0070	0.178	3.96 0.0150	3.92 0.0168	3.90 0.0191	3.87 0.0200	3.81 0.0230	3.81 0.0230
1x7628	41.0%	0.0070	0.178	4.20 0.0149	4.16 0.0166	4.15 0.0189	4.12 0.0200	4.07 0.0230	4.07 0.0230
2x2116	45.0%	0.0080	0.203	4.10 0.0139	4.06 0.0154	4.05 0.0175	4.02 0.0180	3.96 0.0210	3.96 0.0210
2x1080/2116	47.0%	0.0100	0.254	4.05 0.0142	4.01 0.0158	4.00 0.0179	3.97 0.0190	3.91 0.0220	3.91 0.0220
2x1652	42.0%	0.0100	0.254	4.17 0.0134	4.14 0.0149	4.12 0.0167	4.10 0.0170	4.04 0.0200	4.04 0.0200
2x1080/7628	47.0%	0.0120	0.305	4.05 0.0142	4.01 0.0158	4.00 0.0179	3.97 0.0190	3.91 0.0220	3.91 0.0220
2x7628	42.0%	0.0140	0.356	4.17 0.0134	4.14 0.0149	4.12 0.0167	4.10 0.0170	4.04 0.0200	4.04 0.0200
2x7628/2116	42.0%	0.0180	0.457	4.17 0.0134	4.14 0.0149	4.12 0.0167	4.10 0.0170	4.04 0.0200	4.04 0.0200
3x7628	40.0%	0.0210	0.533	4.22 0.0131	4.19 0.0145	4.17 0.0163	4.18 0.0170	4.11 0.0200	4.11 0.0200

Prepreg Data

Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	100 MHz	500 MHz	1 Ghz	2 GHz	5 Ghz	10 GHz
Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
106	75.0%	0.0023	0.058	3.50 0.0186	3.45 0.0212	3.46 0.0246	3.39 0.0260	3.30 0.0310	3.30 0.0310
1080	65.0%	0.0030	0.076	3.68 0.0171	3.63 0.0193	3.61 0.0222	3.58 0.0230	3.50 0.0275	3.50 0.0275
2113	57.0%	0.0039	0.099	3.83 0.0158	3.79 0.0178	3.77 0.0203	3.74 0.0210	3.67 0.0250	3.67 0.0250
2116	56.0%	0.0050	0.127	3.85 0.0156	3.81 0.0176	3.79 0.0205	3.76 0.0210	3.69 0.0250	3.69 0.0250
7628	44.0%	0.0074	0.188	4.12 0.0137	4.09 0.0153	4.07 0.0172	4.04 0.0180	3.98 0.0210	3.98 0.0210

NOTE

Revisions:
A - Original Release - 4/17

Documentation ▼

Resource Title & Summary	Date Updated
IS410 RAILWAY Standard EN 45545-2:2020 R25 Approvals	10/31/2022
IS410 RAILWAY Standard EN 45545-2:2020 R24 Approvals	10/31/2022
IS410 Prepreg Supplemental	03/20/2024
IS410 Laminate Supplemental	03/20/2024
Isola Laminate Outgassing Data Properties	03/22/2024
IS410 Laminate Safety Data Sheet	07/21/2020
IS410 Prepreg Safety Data Sheet	07/21/2020
IS410 Prepreg RoHS Declaration	03/20/2024
IS410 Laminate RoHS Declaration	03/20/2024
IS410 Processing Guide	06/25/2020

Resources

Presentation

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Material & Process Influences on Conductive Anodic Filamentation (CAF)

This presentation describes how Bell Laboratories investigated the mechanism of CAF formation.

Contact Our Team For Product Information

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Property		IS410
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	180
Dk, Permittivity	Resin Content	3.87
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	350
Df, Loss Tangent	Resin Content	0.0230
Moisture Absorption	Resin Content	0.20
Z-Axis CTE	50 to 260°C, (Total Expansion)	3.5
Peel Strength	Standard profile copper >>> After thermal stress	0.90 (5.1)

IS410

Lead-free Epoxy Laminate and Prepreg

IS410 is a high-performance FR-4 epoxy laminate and prepreg system designed to support the printed circuit board industry’s requirements for higher levels of reliability and the trend to use lead‑free solder.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to IS410

Resources

Laminate & Prepreg Manufacturing

Material & Process Influences on Conductive Anodic Filamentation (CAF)

Contact Our Team For Product Information