I-Tera® MT40

Very Low-Loss Laminate and Prepreg

I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

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Thermal Performance

Tg: 215°C
Td: 360°C

Electrical Performance

Dk: 3.45
Df: 0.0031

Industry Approvals

IPC-4103 /17
IPC-4101 /102
UL - File Number E41625

I-Tera MT40 is suitable for many of today’s high speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -55°C and +125°C up to W-band frequencies. In addition, I-Tera MT40 offers a lower dissipation factor (Df) of 0.0031 making it a cost effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.
I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Attributes

HighThermalReliability High Density Interconnect

Markets

MedicalIndustrialInstrumentation AerospaceDefense ComputingStoragePeripherals NetworkingCommunications AutomotiveTransportation

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Multiple reflow capable
    • Multiple lamination cycles

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HVLP (VLP2) ≤2.5 micron Rz JIS
    • RTF (Reverse Treat Foil)
    • Embedded resistor foil
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 215 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 230 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 210 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
 >60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
55
290
2.8
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 12 ppm/°C 2.4.24C
Thermal Conductivity 0.61 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
 3.45 — 2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
 0.0031 — Bereskin Stripline
Volume Resistivity C-96/35/90 1.33 x 107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 105 MΩ 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength 1 oz. EDC foil
1.0 (5.7) 		N/mm (lb/inch) 2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
490 (71.0)
400 (58.0)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
269 (39.0)
241 (35.0)
 MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3060
2784
 ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.234
0.222
 — ASTM D3039
Moisture Absorption 0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Changed VLP2 to HVLP to align with common industry terms 4/21
E: Changed TMA Tg to 210C, DSC Tg to 215C and added DMA at 230C based on long term data 9/22

Download Dk/Df Tables PDF

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 Ghz 15 GHz 20 GHz
1x1067 65.5% 0.0020 0.051 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026
1x1067 71.0% 0.0025 0.064 3.17
0.0023		 3.17
0.0023		 3.17
0.0023		 3.17
0.0023		 3.17
0.0023
1x1078 64.0% 0.0030 0.076 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027
1x1080 65.0% 0.0030 0.076 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027
1x1086 61.0% 0.0030 0.076 3.36
0.0029		 3.36
0.0029		 3.36
0.0029		 3.36
0.0029		 3.36
0.0029
1x1086 65.0% 0.0035 0.089 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027
1x3313 55.0% 0.0040 0.102 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033
2x1035 65.5% 0.0040 0.102 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026
1x3313 59.0% 0.0045 0.114 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030
1x2116 54.5% 0.0050 0.127 3.56
0.0033		 3.56
0.0033		 3.56
0.0033		 3.56
0.0033		 3.56
0.0033
2x1067 70.5% 0.0050 0.127 3.18
0.0023		 3.18
0.0023		 3.18
0.0023		 3.18
0.0023		 3.18
0.0023
2x1086 61.0% 0.0060 0.152 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029
1x2116 60.0% 0.0060 0.152 3.42
0.0029		 3.42
0.0029		 3.42
0.0029		 3.42
0.0029		 3.42
0.0029
2x1086 64.0% 0.0070 0.178 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027
2x3313 55.0% 0.0080 0.203 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033
2x3313 59.0% 0.0090 0.229 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030
2x2116 63.0% 0.0100 0.254 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028
3x3313 55.0% 0.0120 0.305 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033		 3.55
0.0033
2x2116/3313 55.6% 0.0140 0.356 3.54
0.0032		 3.54
0.0032		 3.54
0.0032		 3.54
0.0032		 3.54
0.0032
3x2116 57.0% 0.0160 0.406 3.50
0.0031		 3.50
0.0031		 3.50
0.0031		 3.50
0.0031		 3.50
0.0031
2x3313/2x2116 55.7% 0.0180 0.457 3.54
0.0032		 3.54
0.0032		 3.54
0.0032		 3.54
0.0032		 3.54
0.0032
5x3313 61.0% 0.0240 0.610 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029
8x3313 63.0% 0.0400 1.016 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028
12x3313 63.0% 0.0600 1.524 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028		 3.36
0.0028

Prepreg Data

Glass Style Resin content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
1067 65.5% 0.0020 0.051 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026		 3.30
0.0026
1035 67.0% 0.0022 0.056 3.26
0.0025		 3.26
0.0025		 3.26
0.0025		 3.26
0.0025		 3.26
0.0025
1067 69.0% 0.0024 0.061 3.22
0.0024		 3.22
0.0024		 3.22
0.0024		 3.22
0.0024		 3.22
0.0024
1067 72.0% 0.0026 0.066 3.15
0.0022		 3.15
0.0022		 3.15
0.0022		 3.15
0.0022		 3.15
0.0022
1035 73.0% 0.0027 0.069 3.12
0.0022		 3.12
0.0022		 3.12
0.0022		 3.12
0.0022		 3.12
0.0022
1067 76.0% 0.0032 0.081 3.05
0.0020		 3.05
0.0020		 3.05
0.0020		 3.05
0.0020		 3.05
0.0020
1086 65.0% 0.0035 0.089 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027		 3.31
0.0027
1080 70.0% 0.0037 0.094 3.19
0.0024		 3.19
0.0024		 3.19
0.0024		 3.19
0.0024		 3.19
0.0024
1086 68.0% 0.0039 0.099 3.24
0.0025		 3.24
0.0025		 3.24
0.0025		 3.24
0.0025		 3.24
0.0025
3313 57.0% 0.0043 0.109 3.50
0.0031		 3.50
0.0031		 3.50
0.0031		 3.50
0.0031		 3.50
0.0031
1078 73.0% 0.0043 0.109 3.12
0.0022		 3.12
0.0022		 3.12
0.0022		 3.12
0.0022		 3.12
0.0022
1086 71.0% 0.0044 0.112 3.16
0.0023		 3.16
0.0023		 3.16
0.0023		 3.16
0.0023		 3.16
0.0023
1080 75.0% 0.0046 0.117 3.08
0.0021		 3.08
0.0021		 3.08
0.0021		 3.08
0.0021		 3.08
0.0021
1078 75.0% 0.0047 0.119 3.08
0.0021		 3.08
0.0021		 3.08
0.0021		 3.08
0.0021		 3.08
0.0021
3313 61.0% 0.0048 0.122 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029		 3.41
0.0029
3313 64.0% 0.0053 0.135 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027		 3.34
0.0027
2116 59.0% 0.0057 0.145 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030		 3.45
0.0030
2116 62.0% 0.0063 0.160 3.38
0.0028		 3.38
0.0029		 3.38
0.0029		 3.38
0.0029		 3.38
0.0029

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C-Corrected Availability 2/19
D-Adjusted core thickness and PP RC% 3/19
E-Added 2x1086 6 mil core 10/19
F-Added 1x1080 3 mil and 2x3313 9 mil core, weave type clarified 1/20
G-Removed Weave Type, added 3313 63% RC prepreg as alternate 9/20
H-Corrected Dk values for 3 mil 1x1080, 6 mil 2x1086 & 2x1078 11/21
I- Corrected discrepancies between core and prepreg Dk/Df values 2/23

J-Removed Core: 6.0 mil 1x1078, 6.0 mil 1x1080, 10.0 mil 2x3313

Added Core: 4.5 mil 1x3313, 6.0 mil 1x2116, 7.0 mil 2x1086, 9 mil 2x3313, 10.0 mil 2x2116, 3x2116 16 mil, 40.0 mil 8x3313, 60.0 mil 12x3313
Removed Prepreg: 1035 65.5% RC, 1078 69.0% RC, 1080 73% RC, 1086 71% RC, 3313 63% RC
K-Added 3.0 mil 1086 61%RC Core
All I-Tera MT40 glass is Spread Weave in both directions

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Making Sense of Laminate Dielectric Properties

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

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