Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => — ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 200 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.00 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 360 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0017 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => 0.1 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 250 - 350 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => 1.0 (5.7) ) [tg] => Array ( [value] => 200°C ) [td] => Array ( [value] => 360°C ) )

Astra<sup>®</sup> MT77

Astra^® MT77

Ultra Low Loss, RF/MW Laminate and Prepreg

Tachyon® 200JV laminate materials are latest generation of advanced ultra-high speed, halogen free, ultra-low loss materials.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 222°C Td: 400°C	Dk: 3.06 Df: 0.0009	IPC-4103 /17 UL - File Number E41625

Thermal Performance

Tg: 222°C
Td: 400°C

Electrical Performance

Dk: 3.06
Df: 0.0009

Industry Approvals

IPC-4103 /17

UL - File Number E41625

Tachyon® 200JV is our latest Halogen Free material solution for next generation AI Data Center Server, 5G infrastructure, high end computing as well as wired & wireless communications. Our most advanced resin system has been developed with ultra smooth HVLP4/5 copper foil and the most advanced glass offerings in the industry to deliver a solution capable of meeting the most demanding high data rate requirements with excellent cost for loss performance.

The Tachyon® 200JV resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

Tachyon® 200JV is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. Tachyon® 200JV meets UL94 V-0.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant
- PFAS Free

Performance Attributes
- Lead-free assembly compatible

Processing Advantages
- FR-4 process compatible
- Short lamination cycle
- Reduced drill wear
- No plasma desmear required
- Good flow and fill
- Dimensional stability
- Multiple lamination cycles
- Any layer technology compatible
- HDI technology compatible
- VIPPO design compatible

Production & Manufacturing

Currently manufactured in Asia, North America, Europe

Product Availability

Standard Material Offering: Laminate
- 2.5, 5, 7.5, 10, 12.5, 15, 20, 30, 60 mil ( 0.0635, 0.127, 0.1905, 0.254, 0.3175, 0.381, 0.510, 0.760, 1.50 mm)

Copper Foil Type
- HVLP (VLP2) ≤2.5 micron Rz JIS
- Embedded resistor foil

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Moisture barrier packaging

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		200	°C	2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss		360	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	>60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg	50 - 70 250 - 350	ppm/°C	2.4.24C
X/Y-Axis CTE	Pre-Tg	12	ppm/°C	2.4.24C
Thermal Conductivity		0.45	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 2 GHz B. @ 10 GHz	3.00	—	2.5.5.5
Df, Loss Tangent	A. @ 2 GHz B. @ 10 GHz	0.0017	—	Bereskin Stripline
Volume Resistivity	C-96/35/90	1.33 x 10⁷	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	1.33 x 10⁵	MΩ	2.5.17.1
Dielectric Breakdown		45.4	kV	2.5.6B
Arc Resistance		139	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		45 (1133)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		3 (175-249)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	1 oz. EDC foil	1.0 (5.7)	N/mm (lb/inch)	2.4.8.3
Flexural Strength	A. Length direction B. Cross direction	338 (49.0) 269 (39.0)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	214 (31.0) 165 (24.0)	MPa (kpsi)	ASTM D3039
Poisson's Ratio	A. Length direction B. Cross direction	0.183 0.182	—	ASTM D3039
Moisture Absorption		0.1	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		130	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Changed VLP2 to HVLP to align with common industry terms 4/21

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Standard/ Alternate	Thickness (inch)	Thickness (mm)	2 GHz	5 GHz	10 GHz	15 GHz	20 GHz
Standard/ Alternate	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
Standard	0.0025	0.064	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0050	0.127	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0075	0.191	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0100	0.254	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0125	0.318	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0150	0.381	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0200	0.508	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0300	0.762	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017
Standard	0.0600	1.524	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017	3.00 0.0017

Prepreg Data

Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	2 GHz	5 Ghz	10 Ghz	15 Ghz	20 Ghz
Glass Style	Resin Content %	Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
1035	73.00%	0.0025	0.064	2.97 0.0019	2.97 0.0019	2.97 0.0019	2.97 0.0019	2.97 0.0019
1067	72.00%	0.0025	0.064	2.98 0.0019	2.98 0.0019	2.98 0.0019	2.98 0.0019	2.98 0.0019
1067	77.00%	0.0032	0.081	2.91 0.0018	2.91 0.0018	2.91 0.0018	2.91 0.0018	2.91 0.0018
1078	70.00%	0.0036	0.091	3.01 0.0019	3.01 0.0019	3.01 0.0019	3.01 0.0019	3.01 0.0019
1078	74.00%	0.0042	0.107	2.95 0.0019	2.95 0.0019	2.95 0.0019	2.95 0.0019	2.95 0.0019

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C-Corrected 12.5 mil to mm conversion - 5/24
Standard-Commonly available with the best availability.
Alternate-Available, but not stocked with longer lead time

Documentation ▼

Resource Title & Summary	Date Updated
Astra® MT77 Laminate Supplemental	03/20/2024
Astra® MT77 Prepreg Supplemental	03/20/2024
Isola Laminate Outgassing Data Properties	03/22/2024
Astra® MT77 Processing Guide	06/18/2020
Astra® MT77 Laminate Safety Data Sheet	07/21/2020
Astra® MT77 Laminate RoHS Declaration	03/20/2024
Astra® MT77 Prepreg RoHS Declaration	03/20/2024
Astra® MT77 Prepreg Safety Data Sheet	07/21/2020

Resources

Presentation White Paper Technical Paper

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

This presentation discusses the following: - Printed Circuit Board (PCB) - Requirements for Operation in mmWave Frequency Band - Requirements for Automotive Safety Systems - Available Materials - Case Study: Automotive RADAR

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

This presentation describes Printed Circuit Board (PCB) requirements for advanced automotive safety systems; hybrid PCB construction and benefits and material availability.

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

This paper discusses how new thermoset resins are emerging as a viable alternative for advanced automotive safety systems by offering cost and reliability advantages over

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

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Top

Property		Astra^® MT77
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	200
Dk, Permittivity	Resin Content	3.00
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	360
Df, Loss Tangent	Resin Content	0.0017
Moisture Absorption	Resin Content	0.1
Z-Axis CTE	50 to 260°C, (Total Expansion)	250 - 350
Peel Strength	Standard profile copper >>> After thermal stress	1.0 (5.7)

Astra® MT77

Ultra Low Loss, RF/MW Laminate and Prepreg

Tachyon® 200JV laminate materials are latest generation of advanced ultra-high speed, halogen free, ultra-low loss materials.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Prepreg Data

Add a Product to Compare to Astra® MT77

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

Laminate & Prepreg Manufacturing

Enabling Lower Cost Advanced Automotive Safety Systems Through Hybrid PCB Construction

Thermosets’ Cost and Reliability Advantages for Automotive Radar PCBs

Conductive Anodic Filament Growth Failure

General Form Proposal

Astra^® MT77

Add a Product to Compare to Astra^® MT77