Array ( [new-design] => Array ( [dynval] => [name] => Recommended for New Design [tip] => [secondary] => [value] => 1 ) [halogen-free] => Array ( [dynval] => [name] => Halogen Free [tip] => [secondary] => [value] => — ) [glass-transition-temperature-tg-by-dsc] => Array ( [dynval] => dynval_5707ece602022 [name] => Glass Transition Temperature (Tg) by DSC [tip] => [secondary] => Resin Content [value] => 215 ) [dk-permittivity] => Array ( [dynval] => dynval_576242c12fb0e [name] => Dk, Permittivity [tip] => [secondary] => Resin Content [value] => 3.75 ) [decomposition-temperature-td-by-tga-5-weight-loss] => Array ( [dynval] => dynval_5707eda2bb660 [name] => Decomposition Temperature (Td) by TGA @ 5% weight loss [tip] => [secondary] => Resin Content [value] => 360 ) [df-loss-tangent] => Array ( [dynval] => dynval_5762434d99e96 [name] => Df, Loss Tangent [tip] => [secondary] => Resin Content [value] => 0.0035 ) [moisture-absorption] => Array ( [dynval] => dynval_571676e64598b [name] => Moisture Absorption [tip] => [secondary] => Resin Content [value] => 0.1 ) [z-axis-cte] => Array ( [dynval] => dynval_577e93eec466a [name] => Z-Axis CTE [tip] => [secondary] => 50 to 260°C, (Total Expansion) [value] => 2.8 ) [peel-strength] => Array ( [dynval] => dynval_571676e64597f [name] => Peel Strength [tip] => [secondary] => Standard profile copper >>> After thermal stress [value] => {BR}1.0 (5.7) ) [tg] => Array ( [value] => 215°C ) [td] => Array ( [value] => 360°C ) )

I-Tera<sup>®</sup> MT40 (RF/MW)

I-Tera^® MT40 (RF/MW)

Very Low-Loss Laminate

I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Download Data Sheet Contact Us

Thermal Performance	Electrical Performance	Industry Approvals
Tg: 215°C Td: 360°C	Dk: 3.38 / 3.45 / 3.60 / 3.75 Df: 0.0028 - 0.0035	IPC-4103 /17 UL - File Number E41625

Thermal Performance

Tg: 215°C
Td: 360°C

Electrical Performance

Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035

Industry Approvals

IPC-4103 /17

UL - File Number E41625

I-Tera MT40 is suitable for many of today’s high-speed digital and RF/microwave printed circuit designs. I-Tera MT40 features a dielectric constant (Dk) that is stable between -40°C and +140°C up to W-band frequencies. In addition, I-Tera MT40 offers a very low dissipation factor (Df) of 0.0028 – 0.0035 making it a cost-effective alternative to PTFE and other commercial microwave and high-speed digital laminate materials.

I-Tera MT40 laminate materials are currently being offered in both laminate and prepreg form in typical thicknesses and standard panel sizes. This provides a complete materials solution package for high-speed digital multilayer, hybrid, RF/microwave, multilayer and double-sided printed circuit designs. I-Tera MT40 does not require any special through hole treatments commonly needed when processing PTFE-based laminate materials.

Attributes

Markets

Product Summary ▲

Product Features

Industry Recognition
- UL File Number: E41625
- RoHS Compliant

Performance Attributes
- CAF resistant
- Lead-free assembly compatible

Processing Advantages
- FR-4 process compatible
- Dimensional stability
- Multiple reflow capable
- Multiple lamination cycles

Production & Manufacturing

Currently manufactured in Asia, Europe

Product Availability

Standard Material Offering: Laminate
- 10, 20, 30, 60 mil (0.25, 0.51, 0.76, 1.5 mm)

Copper Foil Type
- HTE Grade 3
- HVLP (VLP2) ≤2.5 micron Rz JIS
- RTF (Reverse Treat Foil)
- Embedded resistor foil

Copper Weight
- ½, 1 and 2 oz (18, 35 and 70 µm) available
- Thinner copper foil available

Glass Fabric Availability
- Square weave glass
- Mechanically spread glass

Typical Values ▼

Property		Typical Value	Units	Test Method
Property		Typical Value	Metric (English)	IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC		215	°C	2.4.25C
Glass Transition Temperature (Tg) by DMA		230	°C	2.4.24.4
Glass Transition Temperature (Tg) by TMA		210	°C	2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss		360	°C	2.4.24.6
Time to Delaminate by TMA (Copper removed)	A. T260 B. T288	>60	Minutes	2.4.24.1
Z-Axis CTE	A. Pre-Tg B. Post-Tg C. 50 to 260°C, (Total Expansion)	55 290 2.8	ppm/°C ppm/°C %	2.4.24C
X/Y-Axis CTE	Pre-Tg	12	ppm/°C	2.4.24C
Thermal Conductivity		0.61	W/m·K	ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)	A. Unetched B. Etched	Pass	Pass Visual	2.4.13.1
Dk, Permittivity	A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz D. @ 10 GHz	3.38 3.45 3.60 3.75	—	2.5.5.5
Df, Loss Tangent	A. @ 10 GHz B. @ 10 GHz C. @ 10 GHz D. @ 10 GHz	0.0028 0.0031 0.0035 0.0035	—	Bereskin Stripline
Volume Resistivity	C-96/35/90	1.33 x 10⁷	MΩ-cm	2.5.17.1
Surface Resistivity	C-96/35/90	1.33 x 10⁵	MΩ	2.5.17.1
Dielectric Breakdown		45.4	kV	2.5.6B
Arc Resistance		139	Seconds	2.5.1B
Electric Strength (Laminate & laminated prepreg)		45 (1133)	kV/mm (V/mil)	2.5.6.2A
Comparative Tracking Index (CTI)		3 (175-249)	Class (Volts)	UL 746A ASTM D3638
Peel Strength	1 oz. EDC foil	1.0 (5.7)	N/mm (lb/inch)	2.4.8C
Flexural Strength	A. Length direction B. Cross direction	490 (71.0) 400 (58.0)	MPa (kpsi)	2.4.4B
Tensile Strength	A. Length direction B. Cross direction	269 (39.0) 241 (35.0)	MPa (kpsi)	ASTM D3039
Poisson's Ratio	A. Length direction B. Cross direction	0.234 0.222	—	ASTM D3039
Moisture Absorption		0.1	%	2.6.2.1A
Flammability (Laminate & laminated prepreg)		V-0	Rating	UL 94
Relative Thermal Index (RTI)		130	°C	UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Changed VLP2 to HVLP to align with common industry terms 4/21
E: Changed TMA Tg to 210C, DSC Tg to 215C and added DMA at 230C based on long term data 9/22

Constructions ▼

Download Dk/Df Tables PDF

Core Data

Thickness (inch)	Thickness (mm)	2 GHz	5 GHz	10 GHz	15 GHz	20 GHz
Thickness (inch)	Thickness (mm)	Dielectric Constant (DK)/ Dissipation Factor (DF)
0.005	0.127	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.010	0.254	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.020	0.508	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.030	0.762	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.040	1.016	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.060	1.524	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028	3.38 0.0028
0.005	0.127	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.0066	0.168	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.010	0.254	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.020	0.508	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.030	0.762	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.060	1.524	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030	3.45 0.0030
0.005	0.127	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032
0.010	0.254	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032
0.020	0.508	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032	3.60 0.0032
0.010	0.254	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033
0.0133	0.338	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033
0.020	0.508	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033
0.030	0.762	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033	3.75 0.0033

NOTE

Revisions:
A-Original Release - 4/17
B-Added 10 mil 3.60 Dk and 30 mil 3.45 Dk - 2/20

Documentation ▼

Resource Title & Summary	Date Updated
I-Tera MT40 Laminate Supplemental	03/20/2024
I-Tera MT40 Prepreg Supplemental	03/20/2024
I-Tera MT40 (RF/MW) Processing Guide	03/26/2024
I-Tera MT40 Laminate Safety Data Sheet	07/21/2020
I-Tera MT 40 Laminate RoHS Declaration	03/20/2024

Resources

Presentation Article

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I-Tera^® MT40 (RF/MW)

Very Low-Loss Laminate

I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

PIM in PCBs: Mechanisms & Mitigation

Passive Intermodulation (PIM) in PCBs

New Thermoset PCB Material Emerging for mmWave Applications

Contact Our Team For Product Information

Property		I-Tera^® MT40 (RF/MW)
Recommended for New Design
Halogen Free		—
Glass Transition Temperature (Tg) by DSC	Resin Content	215
Dk, Permittivity	Resin Content	3.75
Decomposition Temperature (Td) by TGA @ 5% weight loss	Resin Content	360
Df, Loss Tangent	Resin Content	0.0035
Moisture Absorption	Resin Content	0.1
Z-Axis CTE	50 to 260°C, (Total Expansion)	2.8
Peel Strength	Standard profile copper >>> After thermal stress	1.0 (5.7)

I-Tera® MT40 (RF/MW)

Very Low-Loss Laminate

I-Tera® MT40 laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

Thermal Performance

Electrical Performance

Industry Approvals

Thermal Performance

Electrical Performance

Industry Approvals

Attributes

Markets

Product Features

Production & Manufacturing

Product Availability

Core Data

Add a Product to Compare to I-Tera® MT40 (RF/MW)

Resources

PCB Material Selection for RF, Microwave and Millimeter-wave Design

New Thermoset PCB Materials Improve Millimeter Wave Performance and Reliability at Reduced Cost

PIM in PCBs: Mechanisms & Mitigation

Passive Intermodulation (PIM) in PCBs

New Thermoset PCB Material Emerging for mmWave Applications

Contact Our Team For Product Information

I-Tera^® MT40 (RF/MW)

Add a Product to Compare to I-Tera^® MT40 (RF/MW)