Products

Ultra Low Loss Laminate and Prepreg

Ultra Low Loss, RF/MW Laminate and Prepreg

Very Low-Loss Laminate and Prepreg

Very Low-Loss Laminate

Halogen-free, Very Low Loss Laminate and Prepreg

Halogen-free, Very Low Loss Laminate

Low Loss, Epoxy Laminate and Prepreg

Very Low-Loss Laminate

Lead Free, Mid Loss Laminate and Prepreg

Very Low-Loss Laminate

High Reliability Epoxy Laminate and Prepreg

Industry Leading Epoxy Laminate and Prepreg

High Reliability Epoxy Laminate and Prepreg

Halogen Free, High Reliability Laminate and Prepreg

Polyimide UL HB Laminate and Prepreg

Polyimide UL V-0 Laminate and Prepreg

Polyimide UL HB No-Flo® Specialty Prepreg

Lo-Flo® Specialty Prepreg

No-Flo® Specialty Prepreg

Lead Free, Mid Tg Epoxy Laminate and Prepreg

Tetrafunctional Epoxy Laminate and Prepreg

Low Tg Laminate and Prepreg

Standard Loss, High Tg Epoxy Laminate and Prepreg

Mid Loss, Epoxy Laminate and Prepreg

Lead-free Epoxy Laminate and Prepreg

Lead Free Epoxy Laminate and Prepreg

BT-Epoxy Laminate and Prepreg

UV-blocking Epoxy Laminate

Lead Free, Mid Tg Epoxy Laminate and Prepreg

Isola offers a wide range of High-Speed Digital (HSD) materials that deliver superior performance and CAF resistance. These low-loss materials are targeted for applications that require high reliability and signal integrity. Isola also offers halogen-free HSD materials for green electronics.

Thermal reliability requirements can be separated into two categories. The first involves survival of a PCB through assembly without defects such as blisters or delamination. The second category involves thermal reliability in the operating environment over a product’s lifetime. Both types of thermal reliability are critical.

The commercial wireless markets are highly competitive and have an ever increasing demand for more speed and bandwidth. Today’s designers are challenged more than ever with the task of achieving an optimal balance between cost and performance when selecting base materials.

Brominated Flame Retardants (BFRs) have successfully been used in electronic products for decades to reduce fire-related injury and damage, however many companies have chosen non-Halogen based flame retardants in Printed Circuit Board (PCBs) to meet their performance and sustainability requirements.

High Density Interconnect (HDI) attributes are printed circuit board designs that employ increased feature density to achieve lighter weight, reduced layer count, and thinner stack ups.

For bonding and adhesion applications, Isola offers materials that provide minimum resin flow and consistent lamination characteristics. Uneven surfaces are completely enclosed and embedded maintaining consistent layer-­to-­layer spacing.

Isola offers a  product line of polyimide-based no flow prepreg materials for high temperature printed circuit applications.These products consist of a flame resistant, polyimide‑resin system suitable for military, commercial or industrial electronic applications requiring superior performance and the utmost in thermal properties.

Legacy materials are mature products that we have produced and sold for more than 10 years. These products have provided our customers the performance requirements they have needed for thousands of designs. Materials in this category are still being manufactured and sold, but are no longer being actively promoted.

Isola drives innovation into automobile, railway and aircraft electronics with thermally-reliable laminate materials.

Isola helps connect with world with highly reliable and thermally robust materials.

Isola helps designers achieve smaller, more powerful and durable and less power hungry products.

Isola offers high reliability and superior performance laminate materials for extreme conditions.

Isola's high-speed digital materials are the base for the Internet of Things.

Isola materials helps put the consumer in control of their electronic devices.

Isola materials provide cost savings for today’s advanced electronics.