I-Speed®

Low Loss, Epoxy Laminate and Prepreg

I-Speed® is a 180°C Tg FR-4 resin system for multilayer PWB applications where maximum thermal performance and reliability are required.

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Thermal Performance

Tg: 180°C
Td: 360°C

Electrical Performance

Dk: 3.63
Df: 0.0060

Industry Approvals

IPC-4101 /98 /99 /101 /126
UL - File Number E41625

I-Speed® laminate and prepreg products are manufactured with Isolas’ patentable high performance multi-functional resin system, reinforced with electrical grade (E-glass) glass fabric. This system delivers a 15% improvement in Z-axis expansion and offers 25% more electrical bandwidth (lower loss) than competitive products in this space. These properties coupled with superior moisture resistance at reflow, result in a product that bridges the gap from both a thermal and electrical perspective.

The I-Speed® resin system is laser fluorescing and UV blocking for maximum compatibility with Automated Optical Inspection (AOI) systems, optical positioning systems and photo imagable solder mask imaging.

Attributes

HighThermalReliability High Density Interconnect

Markets

ComputingStoragePeripherals NetworkingCommunications AerospaceDefense MedicalIndustrialInstrumentation

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • Qualified to UL’s MCIL Program
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia, North America

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS
    • RTF (Reverse Treat Foil)
    • Advanced RTF ≤2.5 micron Rz JIS
    • Embedded resistor foil
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 180 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 195 °C 2.4.24.4
Decomposition Temperature (Td) by TGA @ 5% weight loss 360 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
 >60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
45
230
2.5
ppm/°C
ppm/°C
%
 2.4.24C
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.4 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 1 GHz
B. @ 2 GHz
C. @ 5 GHz
D. @ 10 GHz
3.65
3.64
3.63
3.63
 —
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Df, Loss Tangent
A. @ 1 GHz
B. @ 2 GHz
C. @ 5 GHz
D. @ 10 GHz
0.0057
0.0059
0.0059
0.0060
 —
2.5.5.9
Bereskin Stripline
Bereskin Stripline
Bereskin Stripline
Volume Resistivity
A. After moisture resistance
B. At elevated temperature
4.4 x 107
9.4 x 107
 MΩ-cm 2.5.17.1
Surface Resistivity
A. After moisture resistance
B. At elevated temperature
2.6 x 106
2.1 x 108
 MΩ 2.5.17.1
Dielectric Breakdown >50 kV 2.5.6B
Arc Resistance 137 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 70 (1741) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-399) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Standard profile copper
    1. After thermal stress
    2. After thermal stress
    3. After process solutions

1.14 (6.5)

0.96 (5.5)
0.90 (5.1)
 N/mm (lb/inch)
2.4.8C

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
462 (67.0)
427 (62.0)
 MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
330 (48.3)
254 (35.6)
 MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
2868
2730
 ksi
ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.173
0.152
 — ASTM D3039
Moisture Absorption 0.061 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C —
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Removed Low Dk glass option - 10/18
D: Change MOT to RTI - 5/19
E: Revised CTI to 2 - 1/21
F: Changed VLP2 to HVLP to align with common industry terms 4/21
G: Correct data sheet Df values to align with Construction table values 12/22
H: Added construction option to 28 mils and added DMA Tg- 3/24
I: Modified alpha 1 CTE from 60 to 45 ppm/C and overall from 50-260C from 2.7% to 2.5% (6x2116 30 mil data) 8/24

Download Dk/Df Tables PDF

Core Data

Construction Resin Content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
1x1067 66.0% 0.0020 0.051 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
1x1067 72.0% 0.0025 0.064 3.45
0.0058		 3.45
0.0058		 3.45
0.0059		 3.45
0.0059		 3.45
0.0059
1x1080 66.0% 0.0030 0.076 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
1x1078 69.5% 0.0035 0.089 3.50
0.0058		 3.50
0.0058		 3.50
0.0059		 3.50
0.0059		 3.50
0.0059
1x3313 52.0% 0.0035 0.089 3.89
0.0060		 3.89
0.0060		 3.89
0.0061		 3.89
0.0061		 3.89
0.0061
2x1067 66.0% 0.0040 0.102 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
1x3313 57.0% 0.0040 0.102 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060
1x2116 56.5% 0.0050 0.127 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
2x1067 72.0% 0.0050 0.127 3.45
0.0058		 3.45
0.0058		 3.45
0.0059		 3.45
0.0059		 3.45
0.0059
2x1080 66.0% 0.0060 0.152 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
2x3313 57.0% 0.0080 0.203 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060
2x2116 56.5% 0.0100 0.254 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
3x3313 57.0% 0.0120 0.305 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060		 3.77
0.0060
3x2116 56.5% 0.0150 0.381 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
4x2116 56.5% 0.0200 0.508 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
1x3313/4x2116 56.6% 0.0240 0.610 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
2x3313/4x2116 56.6% 0.0280 0.711 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060

Prepreg Data

Glass Style Resin content % Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
2 GHz 5 GHz 10 GHz 15 GHz 20 GHz
1067 66.0% 0.0020 0.051 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
1067 70.0% 0.0023 0.058 3.49
0.0058		 3.49
0.0058		 3.49
0.0059		 3.49
0.0059		 3.49
0.0059
1035 71.5% 0.0024 0.061 3.46
0.0058		 3.46
0.0058		 3.46
0.0059		 3.46
0.0059		 3.46
0.0059
1067 74.0% 0.0027 0.069 3.41
0.0058		 3.41
0.0058		 3.41
0.0059		 3.41
0.0059		 3.41
0.0059
1067 76.5% 0.0031 0.079 3.36
0.0058		 3.36
0.0058		 3.36
0.0058		 3.36
0.0058		 3.36
0.0058
1080 66.0% 0.0031 0.079 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059		 3.57
0.0059
1086 64.0% 0.0033 0.084 3.62
0.0059		 3.62
0.0059		 3.62
0.0060		 3.62
0.0060		 3.61
0.0060
1080 69.0% 0.0034 0.086 3.51
0.0059		 3.51
0.0059		 3.51
0.0059		 3.51
0.0059		 3.51
0.0059
1078 69.5% 0.0036 0.091 3.50
0.0059		 3.50
0.0059		 3.50
0.0059		 3.50
0.0059		 3.50
0.0059
1086 70.0% 0.0040 0.102 3.49
0.0058		 3.49
0.0058		 3.49
0.0059		 3.49
0.0059		 3.49
0.0059
3313 57.0% 0.0040 0.102 3.78
0.0060		 3.78
0.0060		 3.78
0.0060		 3.77
0.0060		 3.77
0.0060
1078 73.5% 0.0042 0.107 3.42
0.0058		 3.42
0.0058		 3.42
0.0059		 3.42
0.0059		 3.42
0.0059
3313 59.0% 0.0043 0.109 3.73
0.0060		 3.73
0.0060		 3.73
0.0060		 3.73
0.0060		 3.73
0.0060
2116 56.5% 0.0051 0.130 3.79
0.0060		 3.79
0.0060		 3.79
0.0060		 3.78
0.0060		 3.78
0.0060
2116 59.0% 0.0055 0.140 3.73
0.0060		 3.73
0.0060		 3.73
0.0060		 3.73
0.0060		 3.73
0.0060

NOTE

Revisions:
A-Original-4/17
B-Added Standard & Alternate construction-8/18
C- Corrected 3.5 core 2x1078 to 1x1078
D-Removed Weave Type 9/20
E-Removed core: 1x1035 2.0 mil, 1x1086 3.0 mil, 1x1067 3.5 mil, 2x1035 4.0 mil, 1x2116 4.5 mil, 2x1086 6.0 mil, 3x2116 14.0 mil, 1x3313/2x2116 14 mil, 2x1652/2x2116 21 mil
Replaced core: 1x1035 2.0 mil with 1x1067 2.0 mil, 3x1652/2x3313 24 mil with 4x2116/1x3313 24 mil, 3x1652/2x2116 28 mil with 4x2116/2x3313 28.0 mil
Removed prepreg: 1035 67.0% RC, 106 72.5% RC, 106 76.0% RC, 1067 72% RC, 1035 74.5% RC, 106 78.5% RC, 1035 77% RC, 1086 62% RC, 1086 66.5% RC, 1080 72.5% RC, 2113 59% RC
All I-Speed glass is Spread Weave in both directions

Resources

Making Sense of Laminate Dielectric Properties

This paper highlights the critical selection factors that go beyond a typical product data sheet and explains how these factors must be considered when selecting materials for high speed applications.

Laminate & Prepreg Manufacturing

This presentation describes the process of laminate and prepreg manufacturing.

Quantifying Timing Skew In Differential Signaling using Practical Fiber Weave Model

This presentation outlines practical fiber weave effect model for skew and jitter.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

Modelling Skew and Jitter induced by Fiber weave effect in PCB dielectrics

This presentation describes a practical fiber-weave effect model to mitigate skew.

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