Aerospace & Defense

Isola’s high-speed digital and RF/microwave materials are ideal for military and aerospace applications as they offer high glass-transition temperatures, very high decomposition temperatures and low expansion rates—all attributes required for demanding aerospace & defense applications. Our materials are in stock and ready to ship both domestically and abroad.

Typical Applications include: avionics, communications, satellites, antenna, radar and guidance systems, flight controls, and advanced weaponry systems

Many of our materials meet the stringent requirements of the Airbus Directive ABD0031, “Fireworthiness Requirements Pressurized Section of Fuselage”, having passed flammability, heat, smoke and degassing of toxic vapors testing.

Product Flammability Test
(Vertical Bunsen Burner 12s)
Smoke Test (Specific Optical Density of Smoke) Toxicity Test
(Critical Smoke Concentration)
Tg °C
IS400 Pass Pass Pass 150
IS420 Pass Pass Pass 170
370HR Pass Pass Pass 180
185HR Pass Pass Pass 180
P96 Pass Pass Pass 260
TerraGreen® 400G
Tg: 210°C
Td: 400°C
Dk: 3.05
Df: 0.0018
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IS550H
Tg: 200°C
Td: 400°C
Dk: 4.43
Df: 0.016
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TerraGreen® (RF/MW)
Tg: 200°C
Td: 390°C
Dk: 3.45
Df: 0.0032
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I-Tera® MT40 (RF/MW)
Tg: 200°C
Td: 360°C
Dk: 3.38 / 3.45 / 3.60 / 3.75
Df: 0.0028 - 0.0035
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IS680 AG
Tg: 200°C
Td: 360°C
Dk: 3.00 / 3.38 / 3.45 / 3.48
Df: 0.0020 - 0.0029
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IS680
Tg: 200°C
Td: 360°C
Dk: 2.80-3.45
Df: 0.0025-0.0035
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Tachyon® 100G
Tg: 200°C
Td: 360°C
Dk: 3.02
Df: 0.0021
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370HR
Tg: 180°C
Td: 340°C
Dk: 4.04
Df: 0.0210
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I-Speed®
Tg: 180°C
Td: 360°C
Dk: 3.64
Df: 0.0060
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I-Tera® MT40
Tg: 200°C
Td: 360°C
Dk: 3.45
Df: 0.0031
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P25N
Tg: 250°C
Td: 383°C
Dk: 3.67
Df: 0.0187
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P95/P25
Tg: 260°C
Td: 416°C
Dk: 3.76
Df: 0.017
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P96/P26
Tg: 260°C
Td: 396°C
Dk: 3.76
Df: 0.017
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IS410
Tg: 180°C
Td: 350°C
Dk: 3.97
Df: 0.0200
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G200
Tg: 180°C
Td: 325°C
Dk: 3.70
Df: 0.013
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FR408HR
Tg: 190°C
Td: 360°C
Dk: 3.68
Df: 0.0092
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FR408
Tg: 180°C
Td: 360°C
Dk: 3.67
Df: 0.0120
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FR406N
Tg: 170°C
Td: 300°C
Dk: 4.3
Df: 0.025
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Astra® MT77
Tg: 200°C
Td: 360°C
Dk: 3.00
Df: 0.0017
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185HR
Tg: 180°C
Td: 340°C
Dk: 4.01
Df: 0.0200
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Resources

PCB-Substrate Characterization at Multigigahertz Frequencies Through SIW Measurements

This paper discusses how substrate integrated waveguides (SIWs) mimic the behavior of rectangular waveguides (RWGs) and can be implemented with standard PCB technology.

Laminate Materials with Low Dielectric Properties

This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications.

Conductive Anodic Filament Growth Failure

This paper provides describes Isola's work in finding the right combination of process and design conditions for improved CAF resistant products.

Coated Copper Foils for High Density Interconnects

This paper discusses laser and plasma ablatable dielectric materials, available as coatings on copper.

Anisotropic Design Considerations for 28 Gbps Via to Stripline Transitions

This paper discusses how for 28-56 Gb/s design the homogeneous isotropic material assumption is a key impediment in model to measurement correlation.

An Assessment of the Impact of Lead-Free Assembly Processes on Base Material and PCB Reliability

This paper describes the regulations and lead-free materials and processes, base material properties and presents test data that highlights the importance of specific properties that should be considered when selecting materials for lead-free applications.

Signal Integrity Considerations in High-Reliability Designs

This article outlines the challenges for lead-free designs with demanding signal integrity requirements while managing cost constraints and dispels the perception that signal integrity material challenges only exist with very high-speed applications, requiring long transmission lines.

New Thermoset PCB Material Emerging for mmWave Applications

This paper discusses a new enabling technology which employs a thermoset matrix that has very good adhesion to metals, enabling the use of copper with extremely smooth surfaces.

PCB Material Selection for High-speed Digital Designs

This presentation describes PCB factors that limit high-speed digital performance and the PCB material selection process and Isola product solutions.

PCB Material Selection for RF, Microwave and Millimeter-wave Design

This presentation discusses Printed Circuit Board (PCB) attributes for RF, microwave, millimeter-wave systems through an application example using an advanced automotive safety system.

Thermal Management of PCBs in Embedded Systems

This presentation discusses thermal management considerations for embedded systems.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

ICDs (InterConnect Defects) What are they? Where do they come from? How can we make them go away?

This presentation describes smeared resin, hole debris and post separation ICDs.

Prepreg Selection: Individual Dielectric Space

This application note discusses how a PCB fabricator use a slightly different method of selecting prepreg to achieve specific thickness and fill requirements.

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