IS550H

Halogen Free, High Reliability Laminate and Prepreg

IS550H is our Halogen Free laminate solution for high power & voltage applications that require extreme thermal stability.

Thermal Performance

Tg: 200°C
Td: 400°C

Electrical Performance

Dk: 4.43
Df: 0.016

Industry Approvals

IPC-4101 /140
UL - File Number E41625

IS550H was developed in conjunction with a consortium of industry experts for high power & high voltage applications and PEV & HEV automotive electrification.  The resulting solution addresses critical application needs for use in a harsh environment where very demanding, long term thermal reliability performance, extreme thermal cycling and very high voltage CAF & electro-migration resistance is required.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • Lead-free assembly compatible
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 60 mil (0.05 to 1.5 mm)
  • Copper Foil Type
    • RTF (Reverse Treat Foil)
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Heavier copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 400 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
>60 Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
38
210
2.2
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE Pre-Tg 13-17 ppm/°C 2.4.24C
Thermal Conductivity 0.7 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
4.50
4.43
4.43
2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.014
0.014
0.016
2.5.5.5
Volume Resistivity
A. C-96/35/90
B. At elevated temperature
5.2 x 107
3.2 x 108
MΩ-cm 2.5.17.1
Surface Resistivity
A. C-96/35/90
B. At elevated temperature
1.0 x 108
3.9 x 108
2.5.17.1
Dielectric Breakdown 60 kV 2.5.6B
Arc Resistance >160 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 46.9(1190) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 3 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Standard profile copper
    1. After thermal stress
    2. At 125ºC (257ºF)
1.45 (8.2)
1.35(7.6)
N/mm (lb/inch)

2.4.8.2A
2.4.8.3
Flexural Strength
A. Length direction
B. Cross direction
420 (60.9)
350 (50.8)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
214 (31)
186 (27)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
28,730 (4167)
24,840 (3603)
MPa (ksi) ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.174
0.151
ASTM D3039
Moisture Absorption 0.25 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 150 °C
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 9/19

Core Data

Constructions Resin Content % Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
1x1035 66.0% Standard 0.0020 0.05 4.32
0.0120
4.26
0.0130
4.23
0.0140
4.16
0.0140
4.23
0.0170
4.17
0.0150
1x1080 62.0% Standard 0.0030 0.08 4.40
0.0120
4.33
0.0130
4.30
0.0130
4.24
0.0140
4.30
0.0160
4.24
0.0150
1x3313 57.0% Standard 0.0040 0.10 4.51
0.0120
4.43
0.0120
4.39
0.0120
4.34
0.0130
4.40
0.0160
4.33
0.0160
2x1035 66.0% Standard 0.0040 0.10 4.32
0.0120
4.26
0.0130
4.23
0.0140
4.16
0.0140
4.23
0.0170
4.17
0.0150
1x3313 60.0% Standard 0.0045 0.11 4.44
0.0120
4.37
0.0120
4.34
0.0130
4.28
0.0140
4.34
0.0160
4.28
0.0160
1x2116 55.0% Standard 0.0050 0.13 4.56
0.0120
4.46
0.0120
4.43
0.0120
4.39
0.0130
4.44
0.0160
4.37
0.0160
2x1080 62.0% Standard 0.0060 0.15 4.40
0.0120
4.33
0.0130
4.30
0.0130
4.24
0.0140
4.30
0.0160
4.24
0.0150
1x7628 44.0% Standard 0.0074 0.19 4.83
0.0110
4.70
0.0100
4.65
0.0090
4.64
0.0120
4.67
0.0140
4.61
0.0160
1x7628 47.0% Standard 0.0080 0.20 4.75
0.0110
4.63
0.0100
4.59
0.0100
4.57
0.0120
4.61
0.0150
4.54
0.0160
2x3313 57.0% Standard 0.0080 0.20 4.51
0.0120
4.43
0.0120
4.39
0.0120
4.34
0.0130
4.40
0.0160
4.33
0.0160
2x2116 55.0% Standard 0.0100 0.25 4.56
0.0120
4.46
0.0120
4.43
0.0120
4.39
0.0130
4.44
0.0160
4.37
0.0160
2x7628 44.0% Standard 0.0148 0.37 4.83
0.0110
4.70
0.0100
4.65
0.0090
4.64
0.0120
4.67
0.0140
4.61
0.0160
3x2116 55.0% Standard 0.0150 0.38 4.56
0.0120
4.46
0.0120
4.43
0.0120
4.39
0.0130
4.44
0.0160
4.37
0.0160
2x7628 47.0% Standard 0.0160 0.41 4.75
0.0110
4.63
0.0100
4.59
0.0100
4.57
0.0120
4.61
0.0150
4.54
0.0160
4x2116 55.0% Standard 0.0200 0.51 4.56
0.0120
4.46
0.0120
4.43
0.0120
4.39
0.0130
4.44
0.0160
4.37
0.0160
3x7628 44.0% Standard 0.0220 0.56 4.83
0.0110
4.70
0.0100
4.65
0.0090
4.64
0.0120
4.67
0.0140
4.61
0.0160
4x7628 44.0% Standard 0.0300 0.76 4.83
0.0110
4.70
0.0100
4.65
0.0090
4.64
0.0120
4.67
0.0140
4.61
0.0160
5x7628 47.0% Standard 0.0390 0.99 4.75
0.0110
4.63
0.0100
4.59
0.0100
4.57
0.0120
4.61
0.0150
4.54
0.0160
6x7628 47.0% Standard 0.0480 1.19 4.75
0.0110
4.63
0.0100
4.59
0.0100
4.57
0.0120
4.61
0.0150
4.54
0.0160
8x7628 44.0% Standard 0.0590 1.50 4.83
0.0110
4.70
0.0100
4.65
0.0090
4.64
0.0120
4.67
0.0140
4.61
0.0160

Prepreg Data

Glass Style Resin Content % Standard/ Alternate Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
100 MHz 500 MHz 1 GHz 2 GHz 5 GHz 10 GHz
1035 66.0% Standard 0.0020 0.051 4.32
0.0120
4.26
0.0130
4.23
0.0140
4.16
0.0140
4.23
0.0150
4.17
0.0150
106 76.0% Standard 0.0024 0.061 4.12
0.0130
4.08
0.0140
4.07
0.0150
3.97
0.0150
4.05
0.0150
3.99
0.0150
1035 75.0% Standard 0.0028 0.071 4.14
0.0130
4.10
0.0140
4.09
0.0150
3.99
0.0150
4.07
0.0150
4.01
0.0150
1080 68.0% Standard 0.0033 0.084 4.28
0.0130
4.22
0.0130
4.20
0.0140
4.12
0.0140
4.19
0.0150
4.13
0.0150
1080 72.0% Standard 0.0039 0.099 4.20
0.0130
4.15
0.0140
4.13
0.0150
4.04
0.0150
4.12
0.0150
4.06
0.0150
3313 60.0% Standard 0.0045 0.114 4.44
0.0120
4.37
0.0120
4.34
0.0130
4.28
0.0140
4.34
0.0150
4.28
0.0160
1080 77.0% Alternate 0.0049 0.124 4.10
0.0130
4.07
0.0140
4.05
0.0160
3.95
0.0150
4.04
0.0150
3.98
0.0150
2116 55.0% Standard 0.0050 0.127 4.56
0.0120
4.46
0.0120
4.43
0.0120
4.39
0.0130
4.44
0.0140
4.37
0.0160
2116 58.0% Standard 0.0054 0.137 4.49
0.0120
4.41
0.0120
4.37
0.0120
4.32
0.0130
4.38
0.0150
4.31
0.0160
2116 62.0% Alternate 0.0061 0.155 4.40
0.0120
4.33
0.0130
4.30
0.0130
4.24
0.0140
4.30
0.0150
4.24
0.0150
7628 47.0% Standard 0.0079 0.201 4.75
0.0110
4.63
0.0100
4.59
0.0100
4.57
0.0120
4.61
0.0140
4.54
0.0160
7628 52.0% Standard 0.0090 0.229 4.63
0.0110
4.53
0.0110
4.49
0.0110
4.45
0.0130
4.50
0.0140
4.44
0.0160

NOTE

Revisions:
A-Original-1/2021
B-Added 2x106 4 mil & 1x2116 4.5 mil cores and 106 80% RC prepreg - 8/21
C-Changed construction of 2 mil 1x106 to 1x1035 core, changed 4 mil 2x106 to 2x1035 core, changed 4.5 mil 1x2116 to 1x3313 core, added 7.4 mil 1x7628 and 14.8 mil 2x7828 core, removed 47 mil 6x7628 and 63 mil 8x7628 core. Removed 106 70% and 80% prepreg, added 1035 66%, 3313 60% and 2116 62%. Changed 1080 77% to alternate. - 6/23
D-Added 15 mil and 20 mil constructions - 10/23

Resources

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