TerraGreen® 400G
Halogen-free, Extremely Low Loss Material
TerraGreen® 400G laminate materials are our most advanced ultra high speed, extremely low loss design solution.
Thermal Performance |
Electrical Performance |
Industry Approvals |
Tg:
200°C
Td: >380°C |
Dk:
3.1
Df: 0.0015 |
UL - File Number E41625
|
Thermal Performance
Td: >380°C
Electrical Performance
Df: 0.0015
Industry Approvals
TerraGreen® 400G is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications. Our novel resin system, ultra smooth HVLP3(VLP1) copper foil and Low Dk glass has been engineered for very high data rates of >100 Gb/s with excellent cost for loss performance.
The TerraGreen® 400G resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.
TerraGreen® 400G is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400G meets UL94 V-0.
Product Features
- Industry Recognition
- UL File Number: E41625
- RoHS Compliant
- Performance Attributes
- CAF resistant
- Lead-free assembly compatible
- Halogen free
- 0.8 mm pitch capable
- 6x 260°C reflow capable
- Processing Advantages
- FR-4 process compatible
- Excellent fill and flow for heavy copper
Production & Manufacturing
Currently manufactured in Asia
Product Availability
- Standard Material Offering: Laminate
- 2 to 18 mil (0.05 to 0.46 mm)
- Copper Foil Type
- HLVP3 (VLP1) ≤1.1 micron Rz JIS, 1/2 and 1 oz
- Copper Weight
- ½, 1 oz (18 and 35 µm) available
- Heavier copper available
- Thinner copper foil available
- Standard Material Offering: Prepreg
- Tooling of prepreg panels
- Glass Fabric Availability
- Low Dk glass
- Square weave glass
- Mechanically spread glass
Property | Typical Value | Units | Test Method | |
---|---|---|---|---|
Metric (English) | IPC-TM-650 (or as noted) | |||
Glass Transition Temperature (Tg) by DSC | 200 | °C | 2.4.25C | |
Glass Transition Temperature (Tg) by DMA | 215 | °C | 2.4.24.4 | |
Glass Transition Temperature (Tg) by TMA | 180 | °C | 2.4.24C | |
Decomposition Temperature (Td) by TGA @ 5% weight loss | >380 | °C | 2.4.24.6 | |
Time to Delaminate by TMA (Copper removed) |
A. T288 B. T300
|
60+ | Minutes | 2.4.24.1 |
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold. |
NOTE
Notes:
All data is preliminary and subject to change
* Data was developed using 55% RC rigid laminate
Revisions:
A: Preliminary Release
Core Data
Construction | Resin Content % | Offering | Thickness (inch) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | |||||
---|---|---|---|---|---|---|---|---|---|---|
5 Ghz | 10 GHz | 15 Ghz | 20 Ghz | 28 Ghz SE | 28 Ghz D | |||||
1x1035 | 65.0% | Standard | 0.0020 | 0.051 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1035 | 71.0% | Standard | 0.0025 | 0.064 | 3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1078 | 63.0% | Standard | 0.0030 | 0.076 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
1x1078 | 68.0% | Standard | 0.0035 | 0.089 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1027/1x1035 | 67.0% | Alternate | 0.0035 | 0.089 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1078 | 71.0% | Standard | 0.0040 | 0.102 | 3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
2x1035 | 65.0% | Standard | 0.0040 | 0.102 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
1x1035/1x1067 | 65.0% | Alternate | 0.0040 | 0.102 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
1x3313 | 57.0% | Standard | 0.0040 | 0.102 | 3.40 0.0020 |
3.40 0.0020 |
3.40 0.0020 |
3.30 0.0020 |
3.30 0.0020 |
3.10 0.0018 |
2x1035 | 68.0% | Standard | 0.0045 | 0.114 | 3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1067/1x1035 | 68.0% | Alternate | 0.0045 | 0.114 | 3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1078 | 74.0% | Alternate | 0.0045 | 0.114 | 3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x3313 | 61.0% | Standard | 0.0045 | 0.114 | 3.30 0.0019 |
3.30 0.0019 |
3.30 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.10 0.0017 |
2x1035 | 71.0% | Standard | 0.0050 | 0.127 | 3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x1035/1x1067 | 72.0% | Alternate | 0.0050 | 0.127 | 3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
1x3313 | 64.0% | Standard | 0.0050 | 0.127 | 3.30 0.0019 |
3.30 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
2x1078 | 63.0% | Standard | 0.0060 | 0.152 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
2x1078 | 68.0% | Standard | 0.0070 | 0.178 | 3.20 0.0019 |
3.20 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
3.10 0.0019 |
2.90 0.0017 |
2x3313 | 57.0% | Standard | 0.0080 | 0.203 | 3.40 0.0020 |
3.40 0.0020 |
3.40 0.0020 |
3.30 0.0020 |
3.30 0.0020 |
3.10 0.0018 |
3x1078 | 65.0% | Standard | 0.0100 | 0.254 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.00 0.0017 |
Prepreg Data
Glass | Resin Content % | Offering | Thickness (mils) | Thickness (mm) | Dielectric Constant (DK)/ Dissipation Factor (DF) | ||||
---|---|---|---|---|---|---|---|---|---|
5 Ghz | 10 GHz | 15 GHz | 20 GHz | 28 GHz | |||||
1035 | 65.00% | Standard | 0.002 | 0.051 | 3.20 0.0018 |
3.20 0.0018 |
3.20 0.0018 |
3.20 0.0018 |
3.20 0.0018 |
1035 | 71.00% | Standard | 0.0025 | 0.064 | 3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
1035 | 75.00% | Standard | 0.003 | 0.076 | 3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
1078 | 63.00% | Standard | 0.003 | 0.076 | 3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
3.20 0.0019 |
1078 | 67.50% | Standard | 0.0035 | 0.089 | 3.20 0.0017 |
3.20 0.0017 |
3.20 0.0017 |
3.20 0.0017 |
3.20 0.0017 |
1078 | 71.00% | Standard | 0.004 | 0.102 | 3.20 0.0017 |
3.20 0.0015 |
3.20 0.0015 |
3.20 0.0015 |
3.20 0.0015 |
1078 | 74.00% | Standard | 0.0045 | 0.114 | 3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
3.10 0.0015 |
1080 | 74.50% | Standard | 0.0046 | 0.117 | 3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
3.10 0.0014 |
3313 | 60.50% | Standard | 0.0045 | 0.114 | 3.10 0.0020 |
3.10 0.0020 |
3.10 0.0020 |
3.10 0.0020 |
3.10 0.0020 |
3313 | 64.50% | Standard | 0.0051 | 0.13 | 3.30 0.0018 |
3.30 0.0018 |
3.30 0.0018 |
3.30 0.0018 |
3.30 0.0018 |
3313 | 67.50% | Standard | 0.0057 | 0.145 | 3.30 0.0017 |
3.30 0.0017 |
3.30 0.0017 |
3.30 0.0017 |
3.30 0.0017 |
2116 | 60.50% | Standard | 0.0058 | 0.147 | 3.20 0.0020 |
3.20 0.0020 |
3.20 0.0020 |
3.20 0.0020 |
3.20 0.0020 |
2116 | 63.50% | Standard | 0.0064 | 0.163 | 3.30 0.0019 |
3.30 0.0019 |
3.30 0.0019 |
3.30 0.0019 |
3.30 0.0019 |
NOTE
***ALL DATA IS PRELIMINARY AND SUBJECT TO CHANGE AS ADDITIONAL DATA BECOMES AVAILABLE***
Revisions:
A - Original 1/2020
"Standard" - Commonly available with the best availability.
"Alternate" - Available, but not stocked with longer lead time
All TerraGreen 400G glass is Spread in both directions
Stripline structure
Balance 100 um/4 mil dielectrics. 1 oz copper
LW 100 um/4 mil
Differential Structure
Balance 100 um/4 mil dielectrics. 1 oz copper
LW 100 um/4 mil Space 250 um/10 mil
Resource Title & Summary | Date Updated |
---|---|
TerraGreen 400G Prepreg 2022 RoHS | 11/01/2022 |
TerraGreen 400G Laminate 2022 RoHS | 11/01/2022 |
TerraGreen 400G Processing Guide | 09/02/2022 |
TerraGreen® 400G Prepreg Supplemental | 12/15/2021 |
TerraGreen® 400G Laminate Supplemental | 12/15/2021 |
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