TerraGreen® 400G

Halogen-free, Extremely Low Loss Material

TerraGreen® 400G laminate materials are our most advanced ultra high speed, extremely low loss design solution.

Thermal Performance

Tg: 210°C
Td: 400°C

Electrical Performance

Dk: 3.05
Df: 0.0018

Industry Approvals

UL - File Number E41625

TerraGreen® 400G is our Halogen Free material solution for next generation 5G infrastructure and computing applications. Our novel resin system has been engineered for high data rates with excellent cost for loss performance.

TerraGreen® 400G is lead free compatible and can be processed utilizing standard PCB equipment and processing steps.

TerraGreen®  400G meets UL 94 V-0 and is halogen free.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Lead-free assembly compatible
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
  • Processing Advantages
    • FR-4 process compatible
    • Excellent fill and flow for heavy copper

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HLVP3 (VLP1) ≤1.1 micron Rz JIS, 1/2 and 1 oz
  • Copper Weight
    • ½, 1 oz (18 and 35 µm) available
    • Heavier copper available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • Low Dk glass
    • Square weave glass
    • Mechanically spread glass

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Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials
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