TerraGreen® 400GE

Halogen-free, Ultra Low Loss Material

TerraGreen® 400GE laminate materials are our most advanced ultra-high speed, halogen free ultra-low loss design solution.

Thermal Performance

Tg: 200°C
Td: 380°C

Electrical Performance

Dk: 3.29
Df: 0.0026

Industry Approvals

IPC-4101 /134
UL - File Number E41625

TerraGreen® 400GE is our Halogen Free material solution for next generation 5G infrastructure, data center systems, high end computing, wired & wireless communications and AI applications with data rates  >100 Gb/s. Our novel resin system, RTF3 (<2.5 µm Rz JIS) copper foil and e-glass is our lowest cost member of the TerraGreen 400G® family of products.

The TerraGreen® 400GE resin system has proven superior CAF performance on tight pitch testing. CAF performance is enhanced by the resin systems excellent interlaminar and bond line adhesion strength.

TerraGreen® 400GE is lead free compatible and sequential lamination capable and can be processed utilizing standard PCB equipment and processing steps. TerraGreen® 400GE meets UL94 V-0.

Attributes

Markets

Product Features

  • Industry Recognition
    • UL File Number: E41625
    • RoHS Compliant
  • Performance Attributes
    • CAF resistant
    • Low moisture absorption
    • Halogen free
    • 0.8 mm pitch capable
    • 6x 260°C reflow capable
    • 6x 288°C solder float capable
  • Processing Advantages
    • FR-4 process compatible
    • Multiple lamination cycles
    • HDI technology compatible

Production & Manufacturing

Currently manufactured in Asia

Product Availability

  • Standard Material Offering: Laminate
    • 2 to 18 mil (0.05 to 0.46 mm)
  • Copper Foil Type
    • HVLP3 (VLP1) ≤1.1 micron Rz JIS
    • HVLP (VLP2) ≤2.5 micron Rz JIS
    • Advanced RTF ≤2.5 micron Rz JIS
  • Copper Weight
    • ½, 1 and 2 oz (18, 35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
    • Moisture barrier packaging
  • Glass Fabric Availability
    • E-glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Glass Transition Temperature (Tg) by DMA 215 °C 2.4.24.4
Glass Transition Temperature (Tg) by TMA 180 °C 2.4.24C
Decomposition Temperature (Td) by TGA @ 5% weight loss >380C °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T288
B. T300
60+ Minutes 2.4.24.1
Z-Axis CTE
A. Pre-Tg
B. Post-Tg
C. 50 to 260°C, (Total Expansion)
37
170
1.8
ppm/°C
ppm/°C
%
2.4.24C
X/Y-Axis CTE 12/13 ppm/°C 2.4.24C
Thermal Conductivity 0.54 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 10 GHz
B. @ 20 GHz
3.29
3.25
2.5.5.5
Df, Loss Tangent
A. @ 10 GHz
B. @ 20 GHz
0.0026 2.5.5.5
Volume Resistivity C-96/35/90 2.0x108 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 2.0x107 2.5.17.1
Dielectric Breakdown 70 kV 2.5.6B
Arc Resistance 180 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 67 (1700) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 (250-499) Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. Low profile and very low profile copper foil
B. Low profile and very low profile copper foil ... After thermal stress
0.7 (4.1) N/mm (lb/inch)
2.4.8C

2.4.8.2A
Flexural Strength
A. Length direction
B. Cross direction
393 (57)
338 (49)
MPa (kpsi) 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
220 (32)
193 (28)
MPa (kpsi) ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
14.5 (2100)
13.0 (1900)
GPa(kpsi) ASTM D790-15e2
Flexural Modulus
A. Lengthwise
B. Crosswise
12.1 (1750)
11.7(1700)
GPa (kpsi) ASTM D790-15e2
Moisture Absorption <0.1 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 140 °C UL 746
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Visit our site http://www.isola-group.com for more details.
Revisions:
A: Initial release - 1/23

Core Data

Construction Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
10 GHz 15 Ghz 20 Ghz 30 Ghz
1x1035 63.5% Standard 0.0020 0.051 3.37
0.0026
3.36
0.0026
3.35
0.0026
3.34
0.0026
1x1035 66.5% Standard 0.0023 0.058 3.32
0.0026
3.31
0.0026
3.30
0.0026
3.29
0.0026
1x1035 69.5% Standard 0.0025 0.064 3.27
0.0026
3.26
0.0026
3.25
0.0026
3.24
0.0026
1x1078 61.0% Standard 0.0030 0.076 3.41
0.0026
3.40
0.0026
3.39
0.0026
3.38
0.0026
1x1078 65.5% Standard 0.0035 0.089 3.33
0.0026
3.32
0.0026
3.31
0.0026
3.30
0.0026
2x1035 63.5% Standard 0.0040 0.102 3.37
0.0026
3.36
0.0026
3.35
0.0026
3.34
0.0026
1x3313 53.0% Standard 0.0040 0.102 3.56
0.0027
3.55
0.0027
3.54
0.0027
3.53
0.0027
2x1035 66.5% Standard 0.0045 0.114 3.32
0.0026
3.31
0.0026
3.30
0.0026
3.29
0.0026
2x1035 69.5% Standard 0.0050 0.127 3.27
0.0026
3.26
0.0026
3.25
0.0026
3.24
0.0026
1x2116 52.0% Standard 0.0050 0.127 3.58
0.0027
3.57
0.0027
3.56
0.0027
3.55
0.0027
2x1078 61.0% Standard 0.0060 0.152 3.41
0.0026
3.40
0.0026
3.39
0.0026
3.38
0.0026
2x1078 65.5% Standard 0.0070 0.178 3.33
0.0026
3.32
0.0026
3.31
0.0026
3.30
0.0026
2x3313 53.0% Standard 0.0080 0.203 3.56
0.0027
3.55
0.0027
3.54
0.0027
3.53
0.0027

Prepreg Data

Glass Resin Content % Offering Thickness (inch) Thickness (mm) Dielectric Constant (DK)/ Dissipation Factor (DF)
10 GHz 15 GHz 20 GHz 30 GHz
1035 63.5% Standard 0.0020 0.051 3.37
0.0026
3.36
0.0026
3.35
0.0026
3.34
0.0026
1035 66.5% Standard 0.0023 0.058 3.32
0.0026
3.31
0.0026
3.30
0.0026
3.29
0.0026
1035 69.5% Standard 0.0025 0.064 3.27
0.0026
3.26
0.0026
3.25
0.0026
3.24
0.0026
1035 72.5% Standard 0.0028 0.071 3.22
0.0025
3.21
0.0025
3.20
0.0025
3.19
0.0025
1078 61.0% Standard 0.0030 0.076 3.41
0.0026
3.40
0.0026
3.39
0.0026
3.38
0.0026
1078 65.5% Standard 0.0035 0.089 3.33
0.0026
3.32
0.0026
3.31
0.0026
3.30
0.0026
1078 69.5% Standard 0.0040 0.102 3.27
0.0026
3.26
0.0026
3.25
0.0026
3.24
0.0026
1078 72.0% Standard 0.0044 0.112 3.23
0.0025
3.22
0.0025
3.21
0.0025
3.20
0.0025
3313 58.0% Standard 0.0046 0.117 3.47
0.0027
3.46
0.0027
3.45
0.0027
3.44
0.0027
3313 62.0% Standard 0.0053 0.133 3.39
0.0026
3.38
0.0026
3.37
0.0026
3.36
0.0026
2116 58.5% Standard 0.0060 0.152 3.45
0.0026
3.44
0.0026
3.43
0.0026
3.42
0.0026
2116 61.5% Standard 0.0065 0.165 3.40
0.0026
3.39
0.0026
3.38
0.0026
3.37
0.0026

NOTE

Revisions:
A-Original-3/23
B-Corrected target thickness and RC% values for Prepreg and Laminate -6/23
C-Adjusted Dk values based on test data - 7/23
All TerraGreen 400GE glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked

Contact Our Team For Product Information

Laminates, Prepreg, & PCB Materials

    Isola needs the contact information you provide to us to contact you about our products and services. You may unsubscribe from these communications at any time. For information on how to unsubscribe, as well as our privacy practices and commitment to protecting your privacy, please review our Privacy Policy.