TerraGreen®

Halogen-free, Very Low Loss Laminate and Prepreg

TerraGreen® laminate materials exhibit exceptional electrical properties which are very stable over a broad frequency and temperature range.

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Thermal Performance

Tg: 200°C
Td: 390°C

Electrical Performance

Dk: 3.44
Df: 0.0032

Industry Approvals

IPC-4103 /17
UL - File Number E41625

TerraGreen® is engineered for such highperformance applications as power amplifier boards for LTE base stations, internet infrastructure and cloud computing. TerraGreen® features a Dielectric Constant (Dk) that is stable between -55°C and 125°C, up to 20 GHz.

TerraGreen® is a lead-free assembly material and is easy to process. This high-performance material utilizes a short-lamination cycle; the product is easy to drill, does not require plasma desmear, and the prepreg shelf life is similar to FR-4 materials. TerraGreen® is suitable for high-layer count, high-speed digital backplanes and is compatible with Isola’s FR-4 materials for hybrid designs.

TerraGreen® meets UL 94 V-0 and is halogen free.

Attributes

HighThermalReliability HighSpeedDigital Asset 12

Markets

ComputingStoragePeripherals NetworkingCommunications

Product Features

  • Industry Recognition
    • RoHS Compliant
  • Performance Attributes
    • Lead-free assembly compatible
  • Processing Advantages
    • FR-4 process compatible
    • UV blocking and AOI fluorescence

Production & Manufacturing

Currently manufactured in Europe

Product Availability

  • Standard Material Offering: Laminate
  • Copper Foil Type
    • HTE Grade 3
    • HVLP (VLP2) ≤2.5 micron Rz JIS, 1 oz and below is Standard
  • Copper Weight
    • ½, 1 and 2 oz (18,35 and 70 µm) available
    • Thinner copper foil available
  • Standard Material Offering: Prepreg
    • Tooling of prepreg panels
  • Glass Fabric Availability
    • E-glass
    • Square weave glass
    • Mechanically spread glass
Property Typical Value Units Test Method
Metric (English) IPC-TM-650 (or as noted)
Glass Transition Temperature (Tg) by DSC 200 °C 2.4.25C
Decomposition Temperature (Td) by TGA @ 5% weight loss 390 °C 2.4.24.6
Time to Delaminate by TMA (Copper removed)
A. T260
B. T288
 60 Minutes 2.4.24.1
Z-Axis CTE 50 to 260°C, (Total Expansion) 2.9 % 2.4.24C
X/Y-Axis CTE Pre-Tg 16 ppm/°C 2.4.24C
Thermal Conductivity 0.32 W/m·K ASTM E1952
Thermal Stress 10 sec @ 288ºC (550.4ºF)
A. Unetched
B. Etched
 Pass Pass Visual 2.4.13.1
Dk, Permittivity
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
 3.44 — 2.5.5.5
Df, Loss Tangent
A. @ 2 GHz
B. @ 5 GHz
C. @ 10 GHz
0.0033
0.0032
0.0032
 — Bereskin Stripline
Volume Resistivity C-96/35/90 1.33 x 107 MΩ-cm 2.5.17.1
Surface Resistivity C-96/35/90 1.33 x 105 MΩ 2.5.17.1
Dielectric Breakdown 45.4 kV 2.5.6B
Arc Resistance 139 Seconds 2.5.1B
Electric Strength (Laminate & laminated prepreg) 45 (1133) kV/mm (V/mil) 2.5.6.2A
Comparative Tracking Index (CTI) 2 Class (Volts) UL 746A
ASTM D3638
Peel Strength
A. 0.5 oz. EDC foil
B. 1 oz. EDC foil
0.88 (5.0) 		N/mm (lb/inch) 2.4.8C
Flexural Strength
A. Length direction
B. Cross direction
75.5
60.0
 ksi 2.4.4B
Tensile Strength
A. Length direction
B. Cross direction
40.0
39.0
 ksi ASTM D3039
Young's Modulus
A. Length direction
B. Cross direction
3125
2745
 ksi ASTM D790-15e2
Poisson's Ratio
A. Length direction
B. Cross direction
0.238
0.231
 — ASTM D3039
Moisture Absorption 0.05 % 2.6.2.1A
Flammability (Laminate & laminated prepreg) V-0 Rating UL 94
Relative Thermal Index (RTI) 130 °C UL 796
The data, while believed to be accurate and based on analytical methods considered to be reliable, is for information purposes only. Any sales of these products will be governed by the terms and conditions of the agreement under which they are sold.

NOTE

Revisions:
A: Initial release - 4/17
B: Corrected units for Flexural and Tensile Strength - 8/18
C: Change MOT to RTI 5/19
D: Added CTI value 01/20
E: Changed VLP2 to HVLP to align with common industry terms 4/21
F: Correct data sheet Df values to match Construction table 12/22

Download Dk/Df Tables PDF

NOTE

Revisions:
A-Original Release - 4/17
B-Adjusted 16.8 mil thickness to 16.6 mil thickness -12/19
C-Rationalized construction list -5/20
All TerraGreen glass is Spread Weave in both directions
Standard-Commonly available
Alternate-Available, but not stocked

Resources

High Tg Bromine-free Laminates for PWB Applications

This paper describes chemical approaches that have been evaluated and the effects of those approaches on the performance of these laminates in the fabrication of circuit boards.

Halogen Free Base Materials for PWB Applications

This paper discusses the challenges and concerns of commercially-available non-halogen materials.

Meeting Flame Resistance Requirements for Green Electronics

This presentation discusses challenges and opportunities for halogen-free laminates.

Challenges and Opportunities for Halogen-free Flame Retardants in Anisotropic Composite Dielectric Materials for RF and Microwave Applications

This presentation describes the Flame Retardants (FRs) used in electronic materials and new opportunities for growth.

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